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1. (WO2010113386) INSPECTION CONDITION DATA GENERATION METHOD AND INSPECTION SYSTEM OF SEMICONDUCTOR WAFER APPEARANCE INSPECTION APPARATUS

Pub. No.:    WO/2010/113386    International Application No.:    PCT/JP2010/001375
Publication Date: Fri Oct 08 01:59:59 CEST 2010 International Filing Date: Tue Mar 02 00:59:59 CET 2010
IPC: H01L 21/66
G01N 21/956
Applicants: TORAY ENGINEERING CO., LTD.
東レエンジニアリング株式会社
OHMI, Hidekazu
大美英一
YAMAMOTO, Hisashi
山本比佐史
Inventors: OHMI, Hidekazu
大美英一
YAMAMOTO, Hisashi
山本比佐史
Title: INSPECTION CONDITION DATA GENERATION METHOD AND INSPECTION SYSTEM OF SEMICONDUCTOR WAFER APPEARANCE INSPECTION APPARATUS
Abstract:
A wafer inspection condition generation method for generating inspection condition data for a plurality of inspection apparatuses which inspect the appearance of semiconductor chips formed on wafers (10). The method is provided with the following steps: a step of calculating the individual difference, for each wafer inspection apparatus (A to C), from a design value, then registering individual difference correction data; a step of generating inspection condition data using a wafer (10), at any selected wafer inspection apparatus (A); a step of generating common inspection condition data from the inspection condition data and the individual correction data of the selected wafer inspection apparatus (A); and a step of generating inspection condition data for each wafer inspection apparatus (B to C), from the common inspection condition data and the individual difference correction data of the corresponding wafer inspection apparatus (B to C).