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1. (WO2010113376) FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2010/113376    International Application No.:    PCT/JP2010/000597
Publication Date: Fri Oct 08 01:59:59 CEST 2010 International Filing Date: Wed Feb 03 00:59:59 CET 2010
IPC: H01L 29/786
H01L 21/20
H01L 21/336
H01L 29/423
H01L 29/49
H01L 51/50
Applicants: PANASONIC CORPORATION
パナソニック株式会社
SUZUKI, Takeshi
鈴木武
HOTEHAMA, Kenichi
保手浜健一
NAKATANI, Seiichi
中谷誠一
HIRANO, Koichi
平野浩一
OGAWA, Tatsuo
小川立夫
Inventors: SUZUKI, Takeshi
鈴木武
HOTEHAMA, Kenichi
保手浜健一
NAKATANI, Seiichi
中谷誠一
HIRANO, Koichi
平野浩一
OGAWA, Tatsuo
小川立夫
Title: FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Abstract:
A flexible semiconductor device is provided. The flexible semiconductor device has a supporting layer, a semiconductor structural section formed on the supporting layer, and a resin film formed on the semiconductor structural section. The flexible semiconductor device has an opening section formed in the resin film by means of laser beam irradiation, and a conductive member in contact with the surface of the semiconductor structural section is formed in the opening section in the resin film.