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Machine translation
1. (WO2010113120) AN INTEGRATED CIRCUIT SYSTEM WITH A THERMALLY ISOLATING FRAME CONSTRUCTION AND METHOD FOR PRODUCING SUCH INTEGRATED CIRCUIT SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/113120    International Application No.:    PCT/IB2010/051394
Publication Date: 07.10.2010 International Filing Date: 31.03.2010
IPC:
H01L 23/495 (2006.01)
Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V. [NL/NL]; Groenewoudseweg 1 NL-5621 BA Eindhoven (NL) (For All Designated States Except US).
DE SAMBER, Marc, A. [BE/BE]; (NL) (For US Only).
EGGINK, Hendrik, J. [NL/NL]; (NL) (For US Only).
VAN GRUNSVEN, Eric, C., E. [NL/NL]; (NL) (For US Only)
Inventors: DE SAMBER, Marc, A.; (NL).
EGGINK, Hendrik, J.; (NL).
VAN GRUNSVEN, Eric, C., E.; (NL)
Agent: BEKKERS, Joost, J., J.; High Tech Campus Building 44 NL-5656 AE Eindhoven (NL)
Priority Data:
09157181.0 02.04.2009 EP
Title (EN) AN INTEGRATED CIRCUIT SYSTEM WITH A THERMALLY ISOLATING FRAME CONSTRUCTION AND METHOD FOR PRODUCING SUCH INTEGRATED CIRCUIT SYSTEM
(FR) SYSTÈME DE CIRCUIT INTÉGRÉ PRÉSENTANT UNE CONSTRUCTION DE CADRE D'ISOLATION THERMIQUE ET PROCÉDÉ DE PRODUCTION D'UN TEL SYSTÈME DE CIRCUIT INTÉGRÉ
Abstract: front page image
(EN)An integrated circuit system (1) comprises a first device (2), a second device (4) and a first frame (6) having a first supporting face (18) for supporting the first device (2). The integrated circuit system further comprises a second frame (8) displaced in a direction orthogonal to the first supporting face (18) and having a second supporting face (20) for supporting the second device (4). The second frame (8) is thermally isolated from the first frame (6) and the first device (2). The integrated circuit system further comprises a third frame (9) thermally isolated from the first frame (6) and thermally connected to the second frame (8). A good thermal mutual isolation between the first device (2) and the second device (4) is achieved in the integrated circuit system (1).
(FR)La présente invention concerne un système de circuit intégré (1) comprenant un premier dispositif (2), un second dispositif (4) et un premier cadre (6) doté d'une première surface de support (18) destinée à supporter le premier dispositif (2). Ledit système de circuit intégré comprend en outre un second cadre (8) déplacé dans une direction orthogonale à la première surface de support (18) et possédant une seconde surface de support (20) destinée à supporter le second dispositif (4). Le second cadre (8) est thermiquement isolé du premier cadre (6) et du premier dispositif (2). Le système de circuit intégré comprend en outre un troisième cadre (9) thermiquement isolé du premier cadre (6) et thermiquement relié au second cadre (8). Une bonne isolation thermique réciproque entre le premier dispositif (2) et le second dispositif (4) est obtenue dans le système de circuit intégré (1).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)