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1. (WO2010113120) AN INTEGRATED CIRCUIT SYSTEM WITH A THERMALLY ISOLATING FRAME CONSTRUCTION AND METHOD FOR PRODUCING SUCH INTEGRATED CIRCUIT SYSTEM

Pub. No.:    WO/2010/113120    International Application No.:    PCT/IB2010/051394
Publication Date: Fri Oct 08 01:59:59 CEST 2010 International Filing Date: Thu Apr 01 01:59:59 CEST 2010
IPC: H01L 23/495
Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V.
DE SAMBER, Marc, A.
EGGINK, Hendrik, J.
VAN GRUNSVEN, Eric, C., E.
Inventors: DE SAMBER, Marc, A.
EGGINK, Hendrik, J.
VAN GRUNSVEN, Eric, C., E.
Title: AN INTEGRATED CIRCUIT SYSTEM WITH A THERMALLY ISOLATING FRAME CONSTRUCTION AND METHOD FOR PRODUCING SUCH INTEGRATED CIRCUIT SYSTEM
Abstract:
An integrated circuit system (1) comprises a first device (2), a second device (4) and a first frame (6) having a first supporting face (18) for supporting the first device (2). The integrated circuit system further comprises a second frame (8) displaced in a direction orthogonal to the first supporting face (18) and having a second supporting face (20) for supporting the second device (4). The second frame (8) is thermally isolated from the first frame (6) and the first device (2). The integrated circuit system further comprises a third frame (9) thermally isolated from the first frame (6) and thermally connected to the second frame (8). A good thermal mutual isolation between the first device (2) and the second device (4) is achieved in the integrated circuit system (1).