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1. (WO2010112491) RADIATION CURABLE RESIN COMPOSITION FOR WIRE COATING

Pub. No.:    WO/2010/112491    International Application No.:    PCT/EP2010/054171
Publication Date: Fri Oct 08 01:59:59 CEST 2010 International Filing Date: Wed Mar 31 01:59:59 CEST 2010
IPC: C09D 175/16
H01B 3/30
C08G 18/48
C08G 18/67
C08K 5/521
C08G 18/76
C08F 290/06
Applicants: DSM IP ASSETS B.V.
JSR CORPORATION
YAMAGUCHI, Hiroshi
KAMO, Satoshi
KUROSAWA, Takahiko
Inventors: YAMAGUCHI, Hiroshi
KAMO, Satoshi
KUROSAWA, Takahiko
Title: RADIATION CURABLE RESIN COMPOSITION FOR WIRE COATING
Abstract:
This invention is a radiation curable resin composition for wire coatings that have excellent adhesion with the center conductor as well as having excellent manufacturing efficiency for the coating layer and sufficient strength. This radiation curable resin composition for wire coating comprising the following ingredients (A), (B) and (D): (A) a mixture of a urethane (meth)acrylate having a structure derived from an aliphatic polyol and a urethane (meth)acrylate not having a structure derived from a polyol, (B) a compound having a cyclic structure and one ethylenically unsaturated group, (D) a compound given by the following formula (4a) wherein, R8 is a monovalent organic group having an ethylenically unsaturated group, and R9 is a hydrogen atom or a monovalent organic group that may have an ethylenically unsaturated group.