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1. (WO2010112412) COMPONENT HAVING AN OVERLAPPING LASER TRACK; METHOD FOR PRODUCING SUCH A COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/112412 International Application No.: PCT/EP2010/053972
Publication Date: 07.10.2010 International Filing Date: 26.03.2010
IPC:
B23K 26/06 (2006.01) ,B23K 26/36 (2006.01) ,B23K 26/40 (2006.01) ,B28D 5/00 (2006.01) ,C03B 33/02 (2006.01) ,C03B 33/09 (2006.01) ,H01L 21/78 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
40
taking account of the properties of the material involved
B PERFORMING OPERATIONS; TRANSPORTING
28
WORKING CEMENT, CLAY, OR STONE
D
WORKING STONE OR STONE-LIKE MATERIALS
5
Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33
Severing cooled glass
02
Cutting or splitting sheet glass; Apparatus or machines therefor
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33
Severing cooled glass
09
by thermal shock
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78
with subsequent division of the substrate into plural individual devices
Applicants:
REISS, Kunibert [DE/DE]; DE (UsOnly)
KARL, Thomas [DE/DE]; DE (UsOnly)
KLUGE, Claus Peter [DE/DE]; DE (UsOnly)
CERAMTEC GMBH [DE/DE]; CeramTec-Platz 1-9 73207 Plochingen, DE (AllExceptUS)
Inventors:
REISS, Kunibert; DE
KARL, Thomas; DE
KLUGE, Claus Peter; DE
Agent:
UPPENA, Franz; c/o Chemetall GmbH Trakehner Straße 3 60487 Frankfurt am Main, DE
Priority Data:
10 2009 015 087.031.03.2009DE
Title (EN) COMPONENT HAVING AN OVERLAPPING LASER TRACK; METHOD FOR PRODUCING SUCH A COMPONENT
(FR) COMPOSANT COMPORTANT UN SILLON LASER EN CHEVAUCHEMENT, ET PROCÉDÉ DE FABRICATION D'UN TEL COMPOSANT
(DE) BAUTEIL MIT EINER ÜBERLAPPENDENDEN LASERSPUR; VERFAHREN ZUR HERSTELLUNG EINES SOLCHEN BAUTEILS
Abstract:
(EN) The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into individual components. In order to ensure that, upon separation, the fracture always extends along the laser track (2), fractures deviating from the laser track (2) are avoided, and the fracture edges after fracture are formed evenly and do not have jagged edges, it is proposed that the distance between two adjacent laser holes be less than or equal to the diameter of said laser holes, in each case measured on the surface of the component (1).
(FR) La présente invention concerne un composant (1) présentant un sillon laser (2) constituant une ligne de rupture affaiblie, qui résulte d'impacts d'un rayon laser, et qui prépare le fractionnement ultérieur du composant (1) en composants individuels. Pour garantir que, lors du fractionnement, la rupture intervienne systématiquement le long du sillon laser (2), que l'on évite les ruptures s'écartant du sillon laser (2), et qu'après rupture, les bords de rupture présentent une forme régulière et nette, l'invention propose que la distance entre deux impacts laser voisins n'excède pas le diamètre de l'impact laser mesuré à la surface du composant (1).
(DE) Die Erfindung betrifft ein Bauteil (1) mit einer Laserspur (2) als Bruchinitiierungslinie, die aus Lasereinschüssen eines Laserstrahls besteht, zur Vorbereitung für eine spätere Vereinzelung des Bauteils (1) in Einzelbauteile. Damit sichergestellt ist, dass beim Vereinzeln der Bruch immer entlang der Laserspur (2) verläuft, Brüche abweichend von der Laserspur (2) vermieden werden und die Bruchkanten nach dem Brechen gleichmäßig geformt sind und keine Ausfransungen aufweisen, wird erfindungsgemäß vorgeschlagen, dass der Abstand zwischen zwei benachbarten Lasereinschüssen kleiner oder gleich dem Durchmesser dieser Lasereinschüsse ist, jeweils gemessen an der Oberfläche des Bauteils (1).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)