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Pub. No.:    WO/2010/112272    International Application No.:    PCT/EP2010/052317
Publication Date: 07.10.2010 International Filing Date: 24.02.2010
C08K 3/34 (2006.01), C08K 3/36 (2006.01), C08L 63/00 (2006.01), H02B 13/00 (2006.01)
Applicants: HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH [CH/CH]; Legal Services Department - IP Klybeckstr. 200 CH-4057 Basel (CH) (For All Designated States Except US).
BEISELE, Christian [DE/DE]; (DE) (For US Only).
GRINDLING, Josef [AT/CH]; (CH) (For US Only).
BAER, Daniel [CH/CH]; (CH) (For US Only)
Inventors: BEISELE, Christian; (DE).
BAER, Daniel; (CH)
Priority Data:
09157142.2 02.04.2009 EP
Abstract: front page image
(EN)Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.
(FR)L'invention concerne une composition durcissable comprenant une résine époxy et une composition de charge, un produit durci obtenu en cuisant ladite composition durcissable ainsi que l'utilisation du produit durci comme matériau de construction isolant électrique pour les composants électriques ou électroniques.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)