H | ELECTRICITY |
01 | BASIC ELECTRIC ELEMENTS |
L | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR |
2224 | Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00 |
01 | Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto |
10 | Bump connectors; Manufacturing methods related thereto |
12 | Structure, shape, material or disposition of the bump connectors prior to the connecting process |
13 | of an individual bump connector |
13001 | Core members of the bump connector |
13099 | Material |
131 | with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof |
13101 | the principal constituent melting at a temperature of less than 400°C |
13111 | Tin [Sn] as principal constituent |