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1. WO2010088111 - BONDED MICROELECTROMECHANICAL ASSEMBLIES

Publication Number WO/2010/088111
Publication Date 05.08.2010
International Application No. PCT/US2010/021470
International Filing Date 20.01.2010
IPC
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81B 7/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B41J 2/045 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
015characterised by the jet generation process
04generating single droplets or particles on demand
045by pressure, e.g. electromechanical transducers
CPC
B81B 2201/058
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
05Microfluidics
058Microfluidics not provided for in B81B2201/051 - B81B2201/054
B81C 1/00119
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00023without movable or flexible elements
00119Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
B81C 1/00904
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00865Multistep processes for the separation of wafers into individual elements
00904Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
B81C 2201/0143
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
0128Processes for removing material
0143Focussed beam, i.e. laser, ion or e-beam
B81C 2201/019
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0174for making multi-layered devices, film deposition or growing
019Bonding or gluing multiple substrate layers
Applicants
  • FUJIFILM DIMATIX, INC. [US]/[US] (AllExceptUS)
  • HOISINGTON, Paul A. [US]/[US] (UsOnly)
  • TORREY, Marc A. [US]/[US] (UsOnly)
Inventors
  • HOISINGTON, Paul A.
  • TORREY, Marc A.
Agents
  • ZANOCCO, Jennifer, A.
Priority Data
12/361,43928.01.2009US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) BONDED MICROELECTROMECHANICAL ASSEMBLIES
(FR) ENSEMBLES DE MICROSYSTÈMES ÉLECTROMÉCANIQUES LIÉS
Abstract
(EN)
A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.
(FR)
La présente invention a trait à un dispositif de microsystème électromécanique qui est équipé d'un corps doté d'un composant lié au corps. Le corps est pourvu d'une surface principale et d'une surface latérale adjacente à la surface principale et plus petite par rapport à cette dernière. Le corps est constitué d'un matériau, la surface latérale est constituée du matériau et le corps est une structure cristalline différente de la surface latérale. Le corps inclut un orifice de sortie dans la surface latérale et le composant inclut une ouverture en communisation fluidique avec l'orifice de sortie.
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