H | ELECTRICITY |
01 | BASIC ELECTRIC ELEMENTS |
L | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR |
2224 | Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00 |
01 | Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto |
02 | Bonding areas; Manufacturing methods related thereto |
04 | Structure, shape, material or disposition of the bonding areas prior to the connecting process |
05 | of an individual bonding area |
0554 | External layer |
05599 | Material |
056 | with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof |
05617 | the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C |
05624 | Aluminium [Al] as principal constituent |