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1. WO2010086932 - ONE-PACK TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION

Publication Number WO/2010/086932
Publication Date 05.08.2010
International Application No. PCT/JP2009/006225
International Filing Date 19.11.2009
IPC
C08G 59/50 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
50Amines
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C09J 11/08 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
08Macromolecular additives
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 201/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
02characterised by the presence of specified groups
CPC
C08G 2650/50
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
2650Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
28characterised by the polymer type
50containing nitrogen, e.g. polyetheramines or Jeffamines(r)
C08G 59/184
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
182using pre-adducts of epoxy compounds with curing agents
184with amines
C08G 59/4007
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
C08G 59/4014
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
4014Nitrogen containing compounds
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applicants
  • 株式会社ADEKA ADEKA CORPORATION [JP]/[JP] (AllExceptUS)
  • 小川亮 OGAWA, Ryo [JP]/[JP] (UsOnly)
  • 山田 慎介 YAMADA, Shinsuke [JP]/[JP] (UsOnly)
Inventors
  • 小川亮 OGAWA, Ryo
  • 山田 慎介 YAMADA, Shinsuke
Agents
  • 滝田清暉 TAKITA, Seiki
Priority Data
2009-01761029.01.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ONE-PACK TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE COMPOSITE CYANATE-ÉPOXY DE TYPE À UN SEUL COMPOSANT
(JA) 一液型シアン酸エステル-エポキシ複合樹脂組成物
Abstract
(EN)
Disclosed is a one-pack type cyanate-epoxy composite resin composition, containing (A) a cyanate resin, (B) an epoxy resin, and (C) a latent curing agent.  The latent curing agent (C) contains (a) a modified amine having at least one amino group containing active hydrogen in the molecule obtained by reacting (a-1) a polyamine compound with (a-2) an epoxy compound and (b) a phenolic resin.  The polyamine compound (a-1) is a polyether polyamine compound, and/or the epoxy compound (a-2) is a polyether polyepoxy compound.
(FR)
L'invention porte sur une composition de résine composite cyanate-époxy de type à un seul composant, contenant (A) une résine de cyanate, (B) une résine époxyde et (C) un agent de durcissement latent. L'agent de durcissement latent (C) contient (a) une amine modifiée possédant au moins un groupe amino contenant de l'hydrogène actif dans la molécule, obtenue par réaction de (a-1) un composé polyamine avec (a-2) un composé époxyde et (b) une résine phénolique. Le composé polyamine (a-1) est un composé polyéther-polyamine et/ou le composé époxyde (a-2) est un composé polyéther-polyépoxy.
(JA)
 本発明は、(A)シアン酸エステル樹脂、(B)エポキシ樹脂、及び、(C)潜在性硬化剤を含有してなる一液型シアン酸エステル-エポキシ複合樹脂組成物を開示する。本発明の特徴は、前記潜在性硬化剤(C)が、(a-1)ポリアミン化合物及び(a-2)エポキシ化合物を反応させてなる(a)分子内に活性水素を持つアミノ基を1個以上有する変性アミンと(b)フェノール系樹脂を含有してなると共に、前記(a-1)ポリアミン化合物がポリエーテルポリアミン化合物であるか、及び/又は、前記(a-2)エポキシ化合物がポリエーテルポリエポキシ化合物である点にある。
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