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1. (WO2010085381) REDUCING FAR-END CROSSTALK IN CHIP-TO-CHIP COMMUNICATION SYSTEMS AND COMPONENTS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/085381 International Application No.: PCT/US2010/020474
Publication Date: 29.07.2010 International Filing Date: 08.01.2010
IPC:
H01R 24/00 (2006.01) ,G01R 27/28 (2006.01) ,G01R 31/04 (2006.01) ,H01R 13/10 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
24
Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
27
Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
28
Measuring attenuation, gain, phase shift, or derived characteristics of electric four-pole networks, i.e. two-port networks; Measuring transient response
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
02
Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
04
Testing connections, e.g. of plugs, of non-disconnectable joints
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
10
Sockets for co-operation with pins or blades
Applicants:
HIROSE ELECTRIC CO., LTD. [JP/JP]; 5-23, Osaki 5-Chome, Shinagawa-Ku Tokyo, 141-8587, JP (AllExceptUS)
ARAI, Tatsuya [JP/US]; US (UsOnly)
HUANG, Ching-Chao [US/US]; US (UsOnly)
LUK, Kam Lam, Clement [CN/CN]; CN (UsOnly)
BUAN, Jeremy [US/US]; US (UsOnly)
MATSUO, Tsutomu [JP/US]; US (UsOnly)
TAKADA, Toshiyuki [JP/US]; US (UsOnly)
NAGATA, Masakazu [JP/US]; US (UsOnly)
Inventors:
ARAI, Tatsuya; US
HUANG, Ching-Chao; US
LUK, Kam Lam, Clement; CN
BUAN, Jeremy; US
MATSUO, Tsutomu; US
TAKADA, Toshiyuki; US
NAGATA, Masakazu; US
Agent:
BIRD, John, M.; Sughrue Mion, PLLC 2100 Pennsylvania Ave., N.W., Suite 800 Washington, DC 20037-3213, US
Priority Data:
12/613,49405.11.2009US
61/146,61422.01.2009US
Title (EN) REDUCING FAR-END CROSSTALK IN CHIP-TO-CHIP COMMUNICATION SYSTEMS AND COMPONENTS
(FR) RÉDUCTION DE LA TÉLÉDIAPHONIE DANS LES SYSTÈMES ET COMPOSANTS DE COMMUNICATION DE PUCE À PUCE
Abstract:
(EN) The present invention involves chip-to-chip communication systems for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of systems that can benefit from FEXT reduction.
(FR) La présente invention concerne des systèmes de communication de puce à puce destinés à réduire la télédiaphonie (FEXT) grâce à un changement de la polarité d'origine qui élimine l'effet cumulatif de la FEXT. L'ajustement de la différence de temps de propagation permet d'améliorer la suppression de la FEXT réalisée grâce au changement de polarité. Le ou les emplacements d'inversion de polarité parmi les sources à FEXT sont optimisés pour obtenir une suppression maximale de la FEXT. Cette technique de changement de polarité originale peut s'appliquer à toute une gamme de systèmes susceptibles de retirer un avantage d'une réduction de la FEXT.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)