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1. (WO2010084592) CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENT THEREON
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/084592 International Application No.: PCT/JP2009/050994
Publication Date: 29.07.2010 International Filing Date: 22.01.2009
IPC:
H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
SMK株式会社 SMK Corporation [JP/JP]; 〒1428511 東京都品川区戸越6丁目5番5号 Tokyo 5-5, Togoshi6-chome, Shinagawa-ku, Tokyo 1428511, JP (AllExceptUS)
片岡 靖貴 KATAOKA, Yasutaka [JP/JP]; JP (UsOnly)
前野 清隆 MAENO, Kiyotaka [JP/JP]; JP (UsOnly)
笠置 延生 KASAGI, Nobuo [JP/JP]; JP (UsOnly)
Inventors:
片岡 靖貴 KATAOKA, Yasutaka; JP
前野 清隆 MAENO, Kiyotaka; JP
笠置 延生 KASAGI, Nobuo; JP
Agent:
大谷 嘉一 OTANI, Kaichi; 〒9330023 富山県高岡市末広町14-45 Toyama 14-45, Suehirocho, Takaoka-shi, Toyama 9330023, JP
Priority Data:
Title (EN) CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENT THEREON
(FR) CARTE DE CIRCUIT IMPRIMÉ POUR LE MONTAGE D'UN COMPOSANT ÉLECTRONIQUE
(JA) 電子部品実装用回路基板
Abstract:
(EN) Provided is a circuit board, which is for mounting an electronic component thereon, manufactured at low cost without requiring large equipment, and has a short production lead time and excellent circuit reliability. The circuit board for mounting an electronic component thereon is characterized in that a circuit pattern is formed on a substrate by printing by using a copper conductive ink containing a copper powder, and that a soldering section is formed on the circuit pattern by printing by using a silver conductive ink containing a silver powder.
(FR) L'invention concerne une carte de circuit imprimé servant à monter un composant électronique, fabriquée à bas coût sans nécessiter un équipement important, et présentant un temps de production réduit et une excellente fiabilité des circuits. Cette carte de circuit imprimé servant à monter un composant électronique est caractérisée en ce qu'un motif de circuit est formé sur un substrat par impression en utilisant une encre conductrice au cuivre contenant de la poudre de cuivre, et en ce qu'une section de brasure est formée sur le motif de circuit par impression en utilisant une encre conductrice à l'argent contenant une poudre d'argent.
(JA) 【課題】大型設備が不要で安価に製造でき、生産リードタイムが短く、回路信頼性に優れる電子部品実装用回路基板の提供を目的とする。 【解決手段】銅粉末を含有する銅導電性インクを用いて基板上に回路パターンを印刷形成し、当該回路パターンの上に、銀粉末を含有する銀導電性インクを用いてはんだ付け部を印刷形成してあることを特徴とする。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)