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1. (WO2010084527) DEVICE AND METHOD FOR MAKING HOLE IN THIN PLATE METAL
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/084527 International Application No.: PCT/JP2009/000244
Publication Date: 29.07.2010 International Filing Date: 22.01.2009
IPC:
B21D 28/34 (2006.01) ,B21D 28/24 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
28
Shaping by press-cutting; Perforating
24
Perforating, i.e. punching holes
34
Perforating tools; Die holders
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
28
Shaping by press-cutting; Perforating
24
Perforating, i.e. punching holes
Applicants:
株式会社ワンズ ONES CO., LTD. [JP/JP]; 〒7390411 広島県廿日市市宮島口一丁目12番12号 Hiroshima 12-12, Miyajimaguchi 1-chome, Hatsukaichi-shi, Hiroshima 7390411, JP (AllExceptUS)
オイレス工業株式会社 OILES CORPORATION [JP/JP]; 東京都港区港南一丁目6番34号 6-34, Kounan 1-chome, Minato-ku, Tokyo 1080075, JP (AllExceptUS)
大石政利 OISHI, Masatoshi [JP/JP]; JP (UsOnly)
荒水照夫 ARAMIZU, Teruo [JP/JP]; JP (UsOnly)
Inventors:
大石政利 OISHI, Masatoshi; JP
荒水照夫 ARAMIZU, Teruo; JP
Agent:
高田武志 TAKADA, Takeshi; 〒1070062 東京都港区南青山5丁目12番4号 全菓連ビル3階 Tokyo 3rd Floor, Zenkaren Building 12-4, Minamiaoyama 5-chome Minato-ku, Tokyo 1070062, JP
Priority Data:
Title (EN) DEVICE AND METHOD FOR MAKING HOLE IN THIN PLATE METAL
(FR) DISPOSITIF ET PROCÉDÉ DE RÉALISATION D'UN TROU DANS UNE PLAQUE MINCE EN MÉTAL
(JA) 薄板金属の孔開け装置及びその方法
Abstract:
(EN) A device (1) for making a hole in thin plate metal has an upper die holder (2) vertically moved by a hydraulic ram, a pressing plate (3) secured to the upper die holder (2), a pressing pad (5) suspended from the upper die holder (2) via an elastic member (4), a punch holder (7) secured to the pressing pad (5) by bolts (6) and constructed as a punch unit, a lower die (9) on which thin plate metal (8) in which a hole is to be made is placed, and a die (11) embedded in the lower die (9) and provided with a through-hole (10) having an oval shape corresponding to the shape of the through-hole to be made in the thin plate metal (8).
(FR) L'invention porte sur un dispositif (1) de réalisation d'un trou dans une plaque mince de métal, lequel dispositif comprend un porte-matrice supérieur (2) déplacé verticalement par un coulisseau hydraulique, une plaque de pression (3) fixée sur le porte-matrice supérieur (2), un grain de poussée (5) suspendu au porte-matrice supérieur (2) au moyen d'un élément élastique (4), un porte-poinçon (7) fixé au grain de poussée (5) par des boulons (6) et réalisé sous la forme d'une unité de poinçon, une matrice inférieure (9) sur laquelle est placée la plaque mince (8) de métal dans laquelle un trou doit être réalisé, et une matrice (11) intégrée dans la matrice inférieure (9) comportant un trou traversant (10) ayant une forme ovale correspondant à la forme du trou traversant devant être réalisé dans la plaque mince (8) de métal.
(JA)  薄板金属の孔開け装置1は、油圧ラム等により昇降される上型ホルダ2と、上型ホルダ2に固着された押圧板3と、上型ホルダ2に弾性部材4を介して吊り下げられている押圧パッド5と、押圧パッド5にボルト6等を介して固着されたていると共にパンチユニットとして構成されたパンチホルダ7と、孔開け加工が施される薄板金属8が載置される下型9と、下型9に埋設されていると共に薄板金属8に孔開けすべき貫通孔の形状に一致する長円形の形状の貫通孔10を有するダイス11とを具備している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2010084527US20110283852CN102281962KR1020110110202