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1. (WO2010082992) POLISHING PAD AND SYSTEM WITH WINDOW SUPPORT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/082992 International Application No.: PCT/US2009/067587
Publication Date: 22.07.2010 International Filing Date: 10.12.2009
IPC:
B24B 37/04 (2006.01) ,B24B 49/12 (2006.01) ,B24B 7/12 (2006.01) ,H01L 21/304 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
04
designed for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12
involving optical means
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
7
Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
10
Single-purpose machines or devices
12
for grinding travelling elongated stock, e.g. strip-shaped work
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US (AllExceptUS)
QIAN, Jun [CN/US]; US (UsOnly)
BENVEGNU, Dominic J. [US/US]; US (UsOnly)
CUI, Ningzhuo [CN/US]; US (UsOnly)
SWEDEK, Boguslaw A. [PL/US]; US (UsOnly)
OSTERHELD, Thomas H. [US/US]; US (UsOnly)
Inventors:
QIAN, Jun; US
BENVEGNU, Dominic J.; US
CUI, Ningzhuo; US
SWEDEK, Boguslaw A.; US
OSTERHELD, Thomas H.; US
Agent:
GOREN, David, J.; Fish & Richardson P.C. P.O. Box 1022 Minneapolis, Minnesota 55440-1022, US
Priority Data:
61/145,43516.01.2009US
Title (EN) POLISHING PAD AND SYSTEM WITH WINDOW SUPPORT
(FR) TAMPON DE POLISSAGE ET SYSTÈME DOTÉ D'UN SUPPORT DE FENÊTRE
Abstract:
(EN) A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber.
(FR) Un système de polissage comprend un tampon de polissage présentant une fenêtre de transmission de lumière solide, une fibre optique présentant une extrémité, et une entretoise présentant une ouverture verticale à travers celle-ci. Une surface inférieure de l'entretoise est en contact avec l'extrémité de la fibre optique, une surface supérieure de l'entretoise est en contact avec le côté inférieur de la fenêtre, et l'ouverture verticale est alignée avec la fibre optique.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
JP2012515092CN102281990KR1020110120893