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1. (WO2010081752) SINTERED MATERIAL, SINTERED BOND AND PROCESS FOR PRODUCING A SINTERED BOND
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/081752 International Application No.: PCT/EP2010/050013
Publication Date: 22.07.2010 International Filing Date: 04.01.2010
IPC:
B22F 1/00 (2006.01) ,H01L 21/60 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
ROBERT BOSCH GMBH [DE/DE]; Postfach 30 02 20 70442 Stuttgart, DE (AllExceptUS)
RITTNER, Martin [DE/DE]; DE (UsOnly)
GUENTHER, Michael [DE/DE]; DE (UsOnly)
Inventors:
RITTNER, Martin; DE
GUENTHER, Michael; DE
Common
Representative:
ROBERT BOSCH GMBH; Postfach 30 02 20 70442 Stuttgart, DE
Priority Data:
102009000192.114.01.2009DE
Title (DE) SINTERWERKSTOFF, SINTERVERBINDUNG SOWIE VERFAHREN ZUM HERSTELLEN EINER SINTERVERBINDUNG
(EN) SINTERED MATERIAL, SINTERED BOND AND PROCESS FOR PRODUCING A SINTERED BOND
(FR) MATÉRIAU FRITTÉ, COMPOSÉ FRITTÉ ET PROCÉDÉ DE PRODUCTION D'UN COMPOSÉ FRITTÉ
Abstract:
(DE) Die Erfindung betrifft einen Sinterwerkstoff mit metallischen, mit einer organischen Beschichtung versehenen Strukturpartikeln. Erfindungsgemäß ist vorgesehen, dass nicht-organisch beschichtete, metallische und/oder keramische, beim Sinterprozess nicht ausgasende Hilfspartikel (7) vorgesehen sind. Ferner betrifft die Erfindung eine Sinterverbindung (1) sowie ein Verfahren zum Herstellen einer Sinterverbindung (1).
(EN) The invention relates to a sintered material comprising metallic structure particles provided with an organic coating. It is envisaged in accordance with the invention that metallic and/or ceramic auxiliary particles (7) with a non-organic coating, which do not outgas in the course of the sintering process, are provided. The invention further relates to a sintered bond (1) and to a process for producing a sintered bond (1).
(FR) L'invention concerne un matériau fritté comprenant des particules de structure métalliques, pourvues d'un enrobage organique. L'invention est caractérisée en ce qu'il est prévu d'incorporer au matériau des particules auxiliaires (7) métalliques et/ou céramiques, enrobées non-organiques, ne dégageant pas de gaz lors du processus de frittage. L'invention concerne en outre un composé fritté (1), ainsi qu'un procédé de production d'un composé fritté (1).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
EP2387477JP2012515266US20120003465CN102281973IN4370/CHENP/2011