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1. (WO2010081275) MICRO MACHINING METHOD FOR A SUBSTRATE ON AN UNDERLAY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/081275 International Application No.: PCT/CN2009/001164
Publication Date: 22.07.2010 International Filing Date: 20.10.2009
IPC:
B81C 1/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
Applicants:
北京大学 PEKING UNIVERSITY [CN/CN]; 中国北京市 海淀区颐和园路5号 No.5, Yiheyuan Road, Haidian District Beijing 100871, CN (AllExceptUS)
陈兢 CHEN, Jing [CN/CN]; CN (UsOnly)
张轶铭 ZHANG, Yiming [CN/CN]; CN (UsOnly)
Inventors:
陈兢 CHEN, Jing; CN
张轶铭 ZHANG, Yiming; CN
Agent:
北京君尚知识产权代理事务所(普通合伙) BEIJING JOYSHINE INTELLECTUAL PROPERTY OFFICE; 中国北京市海淀区北四环西路68号左岸工社1316-1317室 Room 1316-1317, Left Bank Community Building No.68 Beisihuanxilu Road, Haidian District Beijing 100080, CN
Priority Data:
200810241103.130.12.2008CN
Title (EN) MICRO MACHINING METHOD FOR A SUBSTRATE ON AN UNDERLAY
(FR) PROCÉDÉ DE MICRO-USINAGE DESTINÉ À UN SUBSTRAT DISPOSÉ SUR UNE SOUS-COUCHE
(ZH) 一种衬底上基片的微细加工方法
Abstract:
(EN) A micro machining method for a substrate on an underlay involves utilizing a polymer as an intermediate adhesion layer, and bonding the underlay with the substrate to form the substrate on the underlay by pressure bonding process; thinning the substrate and deep-etching it to form through holes; backfilling the through holes and deep-etching the substrate again to form a plated hole; plating metal in the plated hole to form a support between the underlay and the substrate; dissolving the through holes and etching the polymer through the through holes to release structures. Or, after forming the substrate on the underlay, thinning the substrate and deep-etching it to form a plated hole; plating metal in the plated hole to form a support between the underlay and the substrate, deep-etching the substrate again to form through holes, and etching the polymer through the through holes to release structures.
(FR) L'invention concerne un procédé de micro-usinage destiné à un substrat disposé sur une sous-couche, impliquant l'utilisation d'un polymère comme couche d'adhésion intermédiaire, et liant la sous-couche au substrat au moyen d'un processus de liaison par pression. Le procédé consiste à : amincir le substrat et le graver en profondeur pour former des trous traversants; remplir les trous traversants et effectuer une nouvelle gravure profonde du substrat pour former un trou plaqué; plaquer un métal dans le trou plaqué pour former un support entre la sous-couche et le substrat; dissoudre les trous traversants et graver le polymère via les trous traversants pour libérer des structures. Dans un autre mode de réalisation, après formation du substrat sur la sous-couche, le procédé consiste à : amincir le substrat et le graver en profondeur pour former un trou plaqué; plaquer un métal dans le trou plaqué pour former un support entre la sous-couche et le substrat, effectuer une nouvelle gravure profonde du substrat pour former des trous traversants, et graver le polymère via les trous traversants pour libérer des structures.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)