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1. (WO2010080423) COMBINED WAFER AREA PRESSURE CONTROL AND PLASMA CONFINEMENT ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/080423 International Application No.: PCT/US2009/068189
Publication Date: 15.07.2010 International Filing Date: 16.12.2009
IPC:
H05H 1/34 (2006.01) ,H01L 21/3065 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H
PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY- CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
1
Generating plasma; Handling plasma
24
Generating plasma
26
Plasma torches
32
using an arc
34
Details, e.g. electrodes, nozzles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306
Chemical or electrical treatment, e.g. electrolytic etching
3065
Plasma etching; Reactive-ion etching
Applicants:
LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway Fremont, CA 94538, US (AllExceptUS)
FISCHER, Andreas [US/US]; US (UsOnly)
KOSHIISHI, Akira [JP/US]; US (UsOnly)
Inventors:
FISCHER, Andreas; US
KOSHIISHI, Akira; US
Agent:
NGUYEN, Joseph, A.; P.O. Box 700640 San Jose, CA 95170, US
Priority Data:
12/361,49028.01.2009US
61/139,49619.12.2008US
Title (EN) COMBINED WAFER AREA PRESSURE CONTROL AND PLASMA CONFINEMENT ASSEMBLY
(FR) ENSEMBLE COMBINÉ DE RÉGULATION DE PRESSION ET CONFINEMENT DE PLASMA SUR ZONE DE PLAQUETTE
Abstract:
(EN) A combined pressure control/plasma confinement assembly configured for confining a plasma and for at least partially regulating pressure in a plasma processing chamber during plasma processing of a substrate is provided. The assembly includes a movable plasma confinement structure having therein a plurality of perforations and configured to surround the plasma when deployed. The assembly also includes a movable pressure control structure disposed outside of the movable plasma confinement structure such that the movable plasma confinement structure is disposed between the plasma and the movable pressure control structure during the plasma processing, the movable pressure control structure being deployable and retractable along with the movable plasma confinement structure to facilitate handling of the substrate, the movable pressure control structure being independently movable relative to the movable plasma confinement structure to regulate the pressure by blocking at least a portion of the plurality of perforations.
(FR) L'invention concerne un ensemble combiné de régulation de pression/confinement de plasma permettant un confinement de plasma et une régulation de pression au moins partielle dans une chambre de traitement au plasma durant le traitement au plasma d'un substrat. L'ensemble comprend une structure de confinement de plasma mobile à plusieurs perforations conçue pour entourer le plasma lors du déploiement de la structure, et il comprend aussi une structure de régulation de pression mobile située en dehors de la structure précédente de sorte que cette dernière soit intercalée entre le plasma et la structure de régulation de pression mobile durant le traitement au plasma; cette structure de régulation de pression mobile peut être déployée et rétractée en même temps que la structure de confinement de plasma mobile pour faciliter la manipulation du substrat; enfin, la structure de régulation de pression mobile est mobile indépendamment de la structure de confinement de plasma mobile, pour une régulation de pression qui s'effectue par blocage d'au moins une partie de la pluralité de perforations.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
SG171841JP2012513094CN102257884KR1020110095378