Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2010080331) ELECTROLESS DEPOSITIONS FROM NON-AQUEOUS SOLUTIONS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/080331 International Application No.: PCT/US2009/067594
Publication Date: 15.07.2010 International Filing Date: 10.12.2009
IPC:
H01L 21/208 (2006.01) ,H01L 21/28 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
208
using liquid deposition
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
Applicants:
LAM RESEARCH CORPOTATION [US/US]; 4650 Cushing Parkway Fremont, CA 94538, US (AllExceptUS)
NORKUS, Eugenijus [LT/LT]; US (UsOnly)
JACIAUSKIENE, Jane [LT/LT]; US (UsOnly)
DORDI, Yezdi [US/US]; US (UsOnly)
Inventors:
NORKUS, Eugenijus; US
JACIAUSKIENE, Jane; US
DORDI, Yezdi; US
Agent:
GENCARELLA, Michael, L.; Martine Penilla & Gencarella, LLP 710 Lakeway Drive, Suite 200 Sunnyvale, CA 94085, US
Priority Data:
12/338,99818.12.2008US
Title (EN) ELECTROLESS DEPOSITIONS FROM NON-AQUEOUS SOLUTIONS
(FR) DÉPÔTS AUTOCATALYTIQUE À PARTIR DE SOLUTIONS NON AQUEUSES
Abstract:
(EN) A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
(FR) La solution non aqueuse pour cuivrage chimique autocatalytique de la présente invention contient un composant anhydre de sel de cuivre, un composant anhydre de sel de cobalt, un agent complexant non aqueux et un solvant non aqueux.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
SG171838JP2012512967CN102265384KR1020110112300