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1. (WO2010079889) METHOD FOR ETCHING MOLDING COMPOUND OF LED AND ETCHING PATTERN ACCORDING TO THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/079889 International Application No.: PCT/KR2009/006885
Publication Date: 15.07.2010 International Filing Date: 23.11.2009
IPC:
H01L 33/52 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
Applicants:
주식회사 아이엠티 IMT CO., LTD. [KR/KR]; 경기도 의왕시 오전동 196-5 벽산선영테크노피아 701 No. 701, Byucksan Sunyoung Technopia Bldg., Ojeon-dong, Uiwang-si Gyeonggi-do 437-821, KR (AllExceptUS)
이종명 LEE, Jong Myoung [KR/KR]; KR (UsOnly)
Inventors:
이종명 LEE, Jong Myoung; KR
Agent:
특허법인 에이아이피 AIP PATENT & LAW FIRM; 서울 강남구 역삼동 823-14 신원빌딩 8층 Shinwon Bldg. 8F, 823-14 Yeoksam-dong, Gangnam-gu Seoul 135-933, KR
Priority Data:
10-2009-000165208.01.2009KR
Title (EN) METHOD FOR ETCHING MOLDING COMPOUND OF LED AND ETCHING PATTERN ACCORDING TO THE SAME
(FR) PROCÉDÉ POUR GRAVER LE COMPOSÉ MOULÉ D'UNE DIODE ÉLECTROLUMINESCENTE, ET MOTIF DE GRAVURE AINSI RÉALISÉ
(KO) LED의 봉지재 에칭 방법 및 그에 따른 에칭 패턴
Abstract:
(EN) Provided are a method for etching a molding compound of an LED and an etching pattern according to the same. The etching method is implemented by an etching apparatus which includes: a laser beam generating unit for generating a laser beam, a laser beam scanning unit for scanning the laser beam; a focus lens unit for creating a laser spot; and a stage unit for loading an LED in a working area. The etching method comprises the steps of: loading the LED in the working area on the stage unit; and etching the molding compound while controlling the laser beam with the laser beam scanning unit according to a preset etching pattern by oscillating the laser beam, wherein the etching pattern may be a dot pattern, grid pattern, or ring pattern. When the molding compound is patterned in plural concentric circles, the upper side of the etching pattern on the molding compound may be formed in a concave, convex, or non-spherical shape.
(FR) La présente invention concerne un procédé pour graver un composé moulé d'une diode électroluminescente ainsi qu'un motif de gravure réalisé selon ce procédé. Le procédé de gravure est mis en œuvre par un appareil à graver qui comporte: un générateur de faisceau laser servant à produire un faisceau laser; un module de balayage laser servant à mettre en balayage le faisceau laser; un objectif de mise au point servant à créer un point laser; et un module plateau servant au chargement d'une diode électroluminescente dans une zone de travail. Le procédé de gravure comporte les opérations consistant à: charger la diode électroluminescente dans la zone de travail sur le module à plateau; et à graver le composé moulé par commande du faisceau laser au moyen du module de balayage laser, selon un motif de gravure prédéfini, par oscillation du faisceau laser, le motif de gravure pouvant être un motif en points, un motif en grille, ou un motif en anneau. Quand la formation du motif sur le composé moulé est réalisée en plusieurs cercles concentriques, la partie supérieure du motif de gravure sur le composé moulé peut prendre une forme concave, convexe ou non sphérique.
(KO) LED의 봉지재의 에칭 방법 및 그에 따른 에칭 패턴이 제공된다. 그러한 에칭 방법은, 레이저 빔을 발생시키는 레이저 발생부와, 레이저 빔을 스캐닝하기 위한 레이저빔 스캐닝부와, 레이저 스폿을 만들기 위한 초점 렌즈부와, LED가 작업 영역에 위치하도록 하기 위한 스테이지부를 포함하는 에칭 장치로써 수행되며, 스테이지부 상의 작업 영역 내에 LED를 로딩하는 단계와, 레이저 빔을 발진시켜 미리 설정된 에칭 패턴에 따라 레이저빔 스캐닝부에서 레이저 빔의 위치를 제어하면서 봉지재를 에칭하는 단계를 포함하며, 에칭 패턴은, 점 패턴, 격자 패턴 및 링 패턴 중 어느 하나일 수 있으며, 봉지재가 복수 개의 동심원들로 패터닝되는 링 패턴인 경우, 동심원들의 피치 및 레이저의 출력을 제어하여, 봉지재의 에칭 패턴의 상부면이, 오목한 형상, 볼록한 형상 및 비구면 형상 중 어느 하나의 형상이 될 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)