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1. (WO2010079746) TESTING APPARATUS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/079746 International Application No.: PCT/JP2010/000044
Publication Date: 15.07.2010 International Filing Date: 06.01.2010
IPC:
G01R 31/28 (2006.01) ,H01L 21/66 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28
Testing of electronic circuits, e.g. by signal tracer
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
株式会社アドバンテスト ADVANTEST CORPORATION [JP/JP]; 東京都練馬区旭町1丁目32番1号 1-32-1, Asahi-cho, Nerima-ku, Tokyo 1790071, JP (AllExceptUS)
佐藤 周作 SATO, Shusaku [JP/JP]; JP (UsOnly)
Inventors:
佐藤 周作 SATO, Shusaku; JP
Agent:
龍華 明裕 RYUKA, Akihiro; 東京都新宿区西新宿6-22-1 新宿スクエアタワー5階 5F, Shinjuku Square Tower, 22-1, Nishi-Shinjuku 6-chome, Shinjuku-ku, Tokyo 1631105, JP
Priority Data:
2009-00294408.01.2009JP
Title (EN) TESTING APPARATUS
(FR) APPAREIL DE TEST
(JA) 試験装置
Abstract:
(EN) Provided is a testing apparatus for testing a device to be tested.  The testing apparatus is provided with: a test head which is arranged to face the device to be tested and is provided with a module which tests the device to be tested; and a probe assembly, which is arranged between the test head and the device to be tested and transmits signals.  The probe assembly is provided with a plurality of low voltage pins arranged at predetermined intervals, and a plurality of high voltage pins, which are arranged such that the distance between each of the high voltage pins and each of the low voltage pins is larger than a predetermined interval, and transmit signals of a voltage higher than that of the low voltage pins.  Each of the high voltage pins is arranged only in either region provided by halving the surface of the probe assembly.
(FR) La présente invention concerne un appareil de test permettant de tester un dispositif devant être testé. Le dispositif de test est équipé d’une tête de test qui est disposée de façon à faire face au dispositif devant être testé et qui est dotée d’un module qui teste le dispositif devant être testé ; et d’un ensemble sonde qui est disposé entre la tête de test et le dispositif devant être testé et qui émet des signaux. L’ensemble sonde est muni d’une pluralité de broches basse tension disposées à intervalles prédéfinis, et d’une pluralité de broches haute tension qui sont disposées de façon que la distance entre chaque broche haute tension et chaque broche basse tension soit supérieure à un intervalle prédéfini, et ledit ensemble émet des signaux d’une tension supérieure à celle des broches basse tension. Chacune des broches haute tension est disposée uniquement dans l’une ou l’autre région formée par la division en deux de la surface de l’ensemble sonde.
(JA)  被試験デバイスを試験する試験装置であって、被試験デバイスと対向して配置され、被試験デバイスを試験するモジュールが設けられるテストヘッドと、テストヘッドおよび被試験デバイスの間に配置されて信号を伝送するプローブアセンブリとを備え、プローブアセンブリには、互いに所定の間隔で配置される複数の低電圧ピンと、複数の低電圧ピンにおけるそれぞれの低電圧ピンとの距離が所定の間隔よりも大きくなるように配置され、低電圧ピンよりも高い電圧の信号を伝送する複数の高電圧ピンとが設けられ、複数の高電圧ピンにおけるそれぞれの高電圧ピンは、プローブアセンブリの面を2等分した領域のいずれか一方にのみ配置される試験装置を提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US20120133382CN102272612DE112010000706