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1. (WO2010079708) HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/079708 International Application No.: PCT/JP2009/071606
Publication Date: 15.07.2010 International Filing Date: 25.12.2009
IPC:
C22C 9/06 (2006.01) ,C22C 9/00 (2006.01) ,C22C 9/01 (2006.01) ,C22C 9/02 (2006.01) ,C22C 9/04 (2006.01) ,C22F 1/08 (2006.01) ,H01B 1/02 (2006.01) ,H01B 5/02 (2006.01) ,H01B 13/00 (2006.01) ,C22F 1/00 (2006.01)
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
06
with nickel or cobalt as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
01
with aluminium as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
02
with tin as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
04
with zinc as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08
of copper or alloys based thereon
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02
mainly consisting of metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
02
Single bars, rods, wires or strips; Bus-bars
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Applicants:
三菱伸銅株式会社 Mitsubishi Shindoh CO., Ltd. [JP/JP]; 東京都品川区北品川4-7-35 4-7-35, Kita-Shinagawa, Shinagawa-ku, Tokyo 1408550, JP (AllExceptUS)
大石恵一郎 OISHI keiichiro [JP/JP]; JP (UsOnly)
Inventors:
大石恵一郎 OISHI keiichiro; JP
Agent:
大中 実 OHNAKA Minoru; 大阪府大阪市中央区南船場2丁目3番6号 第一住建長堀橋駅前ビル4階 Daiichijuken Nagahoribashi-ekimae bldg.4F, 3-6, Minamisemba 2-chome, Chuo-ku, Osaka-shi, Osaka 5420081, JP
Priority Data:
2009-00381309.01.2009JP
Title (EN) HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
(FR) TÔLE LAMINÉE D'ALLIAGE DE CUIVRE HAUTE RÉSISTANCE ET HAUTE CONDUCTIVITÉ, ET PROCÉDÉ DE PRODUCTION CORRESPONDANT
(JA) 高強度高導電銅合金圧延板及びその製造方法
Abstract:
(EN) Disclosed is a low-cost high-strength high-conductivity copper alloy rolled sheet which has an alloy composition that contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P, and 0.005-1.4 mass% of Sn with the balance made up of Cu and unavoidable impurities, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 ≤ ([Co] - 0.007)/([P] - 0.009) ≤ 5.9. In the high-strength high-conductivity copper alloy rolled sheet, deposits are present in the metal structure, and the deposits have a generally circular or generally elliptical shape and an average grain size of 1.5-9.0 nm. Alternatively, not less than 90% of all the deposits are fine deposits having a size of 15 nm or less, and dispersed uniformly. Due to the presence of fine deposits of Co and P, and the solid solution of Sn, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and heat resistance.
(FR) La présente invention concerne une tôle laminée d'alliage de cuivre à haute résistance, à haute conductivité, et bon marché, qui est faite de cobalt (Co) pour 0,14 à 0,34 % de la masse, de phosphore (P) pour 0,046 à 0,098 % de la masse, d'étain (Sn) pour 0,005 à 1,4 % de la masse, le restant étant constitué de cuivre (Cu) et des impuretés résiduelles, tout en respectant entre la teneur en cobalt, exprimée sous la forme [Co] (masse%), et la teneur en phosphore, exprimée sous la forme [P] (masse%), une relation telle que 3,0 ≤ ([Co] – 0,007)/([P] – 0,009) ≤ 5,9. La structure du métal de la tôle laminée d'alliage de cuivre haute résistance et haute conductivité comporte des dépôts présentant une forme généralement circulaire ou généralement elliptique et un calibre moyen des grains de 1,5 à 9,0 nm. Selon un autre mode de réalisation 90% au moins de tous les dépôts sont des dépôts fins uniformément dispersés et dont le calibre n'excéde pas 15 nm. La présence de dépôts fins de cobalt, de phosphore, et de la solution solide d'étain fait que la tôle laminée d'alliage de cuivre haute résistance et haute conductivité peut faire preuve d'une meilleure résistance, d'une meilleure conductivité électrique et d'une meilleure ductilité.
(JA) 0.14~0.34mass%のCoと、0.046~0.098mass%のPと、0.005~1.4mass%のSnと、を含有させ、Coの含有量[Co]mass%とPの含有量[P]mass%との間に、3.0≦([Co]-0.007)/([P]-0.009)≦5.9の関係を有し、かつ残部がCu及び不可避不純物からなる合金組成を有し、金属組織中に析出物を存在させ、前記析出物の形状を略円形、又は略楕円形状とし、析出物の平均粒径を1.5~9.0nm、又は全ての該析出物の90%以上が15nm以下の大きさの微細析出物とし、均一に分散させ、Co及びPの微細な析出物が析出することと、Snの固溶とによって、強度、導電率及び耐熱性が向上した低コストの高強度高導電銅合金圧延板。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2386666JP4785990JPWO2010079708US20110265916CN102149835KR1020110033862
BRPI0919605IN8945/DELNP/2010