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1. (WO2010079707) HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/079707 International Application No.: PCT/JP2009/071599
Publication Date: 15.07.2010 International Filing Date: 25.12.2009
IPC:
C22C 9/06 (2006.01) ,C22C 9/00 (2006.01) ,C22C 9/01 (2006.01) ,C22C 9/02 (2006.01) ,C22C 9/04 (2006.01) ,C22F 1/08 (2006.01) ,H01B 1/02 (2006.01) ,H01B 5/02 (2006.01) ,H01B 13/00 (2006.01) ,C22F 1/00 (2006.01)
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
06
with nickel or cobalt as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
01
with aluminium as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
02
with tin as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
04
with zinc as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08
of copper or alloys based thereon
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02
mainly consisting of metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
02
Single bars, rods, wires or strips; Bus-bars
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Applicants:
三菱伸銅株式会社 Mitsubishi Shindoh CO., Ltd. [JP/JP]; 東京都品川区北品川4-7-35 4-7-35, Kita-Shinagawa, Shinagawa-ku, Tokyo 1408550, JP (AllExceptUS)
大石恵一郎 OISHI Keiichiro [JP/JP]; JP (UsOnly)
Inventors:
大石恵一郎 OISHI Keiichiro; JP
Agent:
大中 実 OHNAKA Minoru; 大阪府大阪市中央区南船場2丁目3番6号 第一住建長堀橋駅前ビル4階 Daiichijuken Nagahoribashi-ekimae bldg. 4F, 3-6, Minamisemba 2-chome, Chuo-ku, Osaka-shi, Osaka 5420081, JP
Priority Data:
2009-00366609.01.2009JP
Title (EN) HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
(FR) TÔLE LAMINÉE D'ALLIAGE DE CUIVRE HAUTE RÉSISTANCE ET HAUTE CONDUCTIVITÉ, ET PROCÉDÉ DE PRODUCTION CORRESPONDANT
(JA) 高強度高導電銅合金圧延板及びその製造方法
Abstract:
(EN) Disclosed is a high-strength high-conductivity copper alloy rolled sheet which contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P and 0.005-1.4 mass% of Sn, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 ≤ ([Co] - 0.007)/([P] - 0.009) ≤ 5.9. The high-strength high-conductivity copper alloy rolled sheet has a total cold rolling reduction of not less than 70%, and a recrystallization ratio of not more than 45% after the final deposition heat treatment process. The recrystallized grains have an average crystal grain size of 0.7-7 μm, the deposits have an average grain size of 2.0-11 nm, and the fine crystals have an average grain size of 0.3-4 μm. The area ratio of the fine crystals relative to the entire metal structure is 0.1-25%. Due to the fine deposits of Co, P and the like, solid solution of Sn, and fine crystals, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and ductility.
(FR) La présente invention concerne une tôle laminée d'alliage de cuivre haute résistance et haute conductivité qui contient du cobalt (Co) pour 0,14 à 0,34 % de la masse, du phosphore (P) pour 0,046 à 0,098 % de la masse, et de l'étain (Sn) pour 0,005 à 1,4 % de la masse, tout en respectant entre la teneur en cobalt, exprimée sous la forme [Co] (masse%), et la teneur en phosphore, exprimée sous la forme [P] (masse%), une relation telle que 3,0 ≤ ([Co] – 0,007)/([P] – 0,009) ≤ 5,9. Cette tôle laminée d'alliage de cuivre haute résistance et haute conductivité présente une réduction par laminage à froid totale d'au moins 70 %, et un rapport de recristallisation d'au moins 45% après le traitement thermique de dépôt final. Les grains recristallisés présentent un calibre moyen des grains des cristaux de 0,7 à 7 µm. Le dépôt présente un calibre moyen des grains de 2,0 à 11 nm. Les cristaux fins présentant un calibre moyen des grains de 0,4 à 4 µm. Le rapport de surface entre les cristaux fins et la totalité de la structure du métal est de 0,1 à 25 %. La présence de dépôts fins de cobalt, de phosphore, et analogue, de la solution solide d'étain, et des cristaux fins fait que la tôle laminée d'alliage de cuivre haute résistance et haute conductivité peut faire preuve d'une meilleure résistance, d'une meilleure conductivité électrique et d'une meilleure ductilité.
(JA)  0.14~0.34mass%のCoと、0.046~0.098mass%のPと、0.005~1.4mass%のSnと、を含有し、Coの含有量[Co]mass%とPの含有量[P]mass%との間に、3.0≦([Co]-0.007)/([P]-0.009)≦5.9の関係を有し、トータル冷間圧延率が70%以上であり、最終の析出熱処理工程後において、再結晶率が45%以下であって再結晶粒の平均結晶粒径が0.7~7μmであり、析出物の平均粒径が2.0~11nmであり、微細結晶の平均粒径が0.3~4μmであって金属組織全体に対する面積の割合が0.1~25%である、CoとP等の微細な析出物と、Snの固溶と、微細結晶とによって、強度、導電率及び延性が向上した高強度高導電銅合金圧延板。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2377958JPWO2010079707US20110265917CN102165080KR1020110031987