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1. (WO2010079633) WIRE BONDING APPARATUS AND WIRE BONDING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/079633 International Application No.: PCT/JP2009/062688
Publication Date: 15.07.2010 International Filing Date: 13.07.2009
IPC:
H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
株式会社新川 SHINKAWA LTD. [JP/JP]; 東京都武蔵村山市伊奈平2丁目51番地の1 51-1,Inadaira 2-chome,Musashimurayama-shi, Tokyo 2088585, JP (AllExceptUS)
鄭 森介 TEI, Shinsuke; JP (UsOnly)
富山 俊彦 TOYAMA, Toshihiko [JP/JP]; JP (UsOnly)
Inventors:
鄭 森介 TEI, Shinsuke; JP
富山 俊彦 TOYAMA, Toshihiko; JP
Agent:
吉田 研二 YOSHIDA, Kenji; 東京都武蔵野市吉祥寺本町1丁目34番12号 34-12,Kichijoji-honcho 1-chome,Musashino-shi, Tokyo 1800004, JP
Priority Data:
2009-00196107.01.2009JP
Title (EN) WIRE BONDING APPARATUS AND WIRE BONDING METHOD
(FR) APPAREIL ET PROCÉDÉ DE MICROCÂBLAGE
(JA) ワイヤボンディング装置及びボンディング方法
Abstract:
(EN) A wire bonding apparatus is provided with a wire cutting means which cuts a wire by bringing up a capillary and a first clamper with the first clamper closed, after bonding the wire by means of the capillary; and a wire extending means which extends a tail wire to a capillary leading end by bringing up the capillary and the first clamper with the first clamper opened and the second clamper closed, after bringing up the capillary.  Thus, wire removal and wire bending are effectively suppressed in the wire bonding apparatus.
(FR) On décrit un appareil de microcâblage muni d'un moyen de coupure de fils qui coupe un fil en amenant un capillaire et une première pince, la première pince étant fermée, après avoir soudé le fil au moyen du capillaire ; et un moyen de prolongation de fils qui prolonge un fil d'extrémité arrière jusqu'à une extrémité avant du capillaire en amenant le capillaire et la première pince, la première pince étant ouverte et la deuxième pince étant fermée, après avoir amené le capillaire. On parvient ainsi à limiter efficacement l'enlèvement de fils et le pliage de fils dans l'appareil de microcâblage.
(JA)  キャピラリによってワイヤをボンディングした後、第1クランパを閉じたままキャピラリと第1クランパとを上昇させてワイヤを切断するワイヤ切断手段と、キャピラリを上昇させた後、第1クランパを開、第2クランパを閉とし、キャピラリと第1クランパとを上昇させてキャピラリ先端にテールワイヤを延出するワイヤ延出手段とを備える。これにより、ワイヤボンディング装置において、ワイヤ抜けやワイヤ曲がりをより効果的に抑制する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
SG172906CN102272911KR1020110094227