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1. (WO2010078565) MAGNET BAR SUPPORT SYSTEM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/078565 International Application No.: PCT/US2010/020079
Publication Date: 08.07.2010 International Filing Date: 05.01.2010
IPC:
H01L 21/203 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
203
using physical deposition, e.g. vacuum deposition, sputtering
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95054, US (AllExceptUS)
MALASZEWSKI, Leszek [US/US]; US (UsOnly)
RIETZEL, James G. [US/US]; US (UsOnly)
Inventors:
MALASZEWSKI, Leszek; US
RIETZEL, James G.; US
Agent:
PATTERSON, B. Todd; Patterson & Sheridan, L.L.P.. 3040 Post Oak Blvd., Suite 1500 Houston, Texas 77056-6582, US
Priority Data:
61/142,52105.01.2009US
Title (EN) MAGNET BAR SUPPORT SYSTEM
(FR) SYSTÈME DE SUPPORT DE BARRE AIMANTÉE
Abstract:
(EN) An apparatus and method for controlling local deposition rate in a physical vapor deposition process is provided. A magnet bar assembly is disposed inside a sputtering target. The magnet bar assembly comprises a magnet bar, a support member aligned with the magnet bar, and one or more sliding brackets that couple the support member to the magnet bar. Each sliding bracket compresses the magnet bar to the support member, allowing the use of spacers between the support member and the magnet bar to adjust local proximity of the magnet bar to the plasma bombarding the target.
(FR) L'invention concerne un appareil et un procédé qui permettent de réguler la vitesse de dépôt local dans un procédé de dépôt par évaporation sous vide. Un ensemble barre aimantée est disposé à l'intérieur d'une cible de pulvérisation cathodique. L'ensemble barre aimantée comporte une barre aimantée, un élément de support aligné sur ladite barre, et un ou plusieurs crochets coulissants qui couplent l'élément de support à ladite barre. Chaque crochet coulissant comprime ladite barre sur l'élément de support, ce qui permet d'utiliser des entretoises entre l'élément de support et la barre aimantée afin d'ajuster la proximité locale de ladite barre par rapport au plasma bombardant la cible.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)