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1. (WO2010078414) METHOD OF PRODUCING A COMPONENT OF A DEVICE, AND THE RESULTING COMPONENTS AND DEVICES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/078414 International Application No.: PCT/US2009/069803
Publication Date: 08.07.2010 International Filing Date: 30.12.2009
IPC:
H01L 21/302 (2006.01) ,H01L 21/50 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
Applicants:
3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US (AllExceptUS)
KOLB, William, Blake. [US/US]; US (UsOnly)
DUDLEY, William, R. [US/US]; US (UsOnly)
JOHNSON, Michael, A. [US/US]; US (UsOnly)
JOHNSON, Stephen, A. [US/US]; US (UsOnly)
TANLEY, Chris, J. [US/US]; US (UsOnly)
Inventors:
KOLB, William, Blake.; US
DUDLEY, William, R.; US
JOHNSON, Michael, A.; US
JOHNSON, Stephen, A.; US
TANLEY, Chris, J.; US
Agent:
BAUM, Scott, A.; 3M Center Office of Intellectual Property Counsel Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US
Priority Data:
61/141,97331.12.2008US
Title (EN) METHOD OF PRODUCING A COMPONENT OF A DEVICE, AND THE RESULTING COMPONENTS AND DEVICES
(FR) PROCÉDÉ DE FABRICATION D'UN COMPOSANT D'UN DISPOSITIF, ET COMPOSANTS ET DISPOSITIFS RÉSULTANTS
Abstract:
(EN) The present method comprises providing a flexible web substrate (e.g., polymeric flexible web substrates) that forms at least part of a component of a device, coating so as to wet-out on and cover all or a substantial portion of a major surface on one side or both sides of the flexible web substrate with flowable polymeric material, while the flexible web substrate is moving in a down-web direction, and solidifying the polymeric material so as to form one cleaning layer on the major surface of one side or both sides of the flexible web substrate. The present invention can be utilized in a continuous in-line manufacturing process. In applications of the present invention where the flexible web substrate will not form a component of a device, the present invention broadly provides a method for cleaning particles from a flexible web of indefinite length. Each cleaning layer forms a substantially adhesive bond to the major surface that is readily removable without damaging or leaving a substantial residue of cleaning layer material on the major surface. A substantial number of the particles that were on this major surface are captured by and removable with the cleaning layer.
(FR) La présente invention porte sur un procédé qui consiste à se procurer un substrat en bande flexible (par exemple, substrats polymères en bande flexible) qui forme au moins une partie d'un composant d'un dispositif, à appliquer en revêtement une matière polymère apte à s'écouler de façon à imprégner complètement et à recouvrir la totalité ou une partie substantielle d'une surface majeure sur un côté ou les deux côtés du substrat en bande flexible, tandis que le substrat en bande flexible se déplace dans une direction de bande descendante, et à faire se solidifier la matière polymère de façon à former une couche de nettoyage sur la surface majeure d'un côté ou des deux côtés du substrat en bande flexible. La présente invention peut être utilisée dans un procédé de fabrication en ligne continu. Dans des applications de la présente invention où le substrat en bande flexible ne formera pas un composant d'un dispositif, la présente invention porte de façon générale sur un procédé de nettoyage de particules à partir d'une bande flexible de longueur indéfinie. Chaque couche de nettoyage forme une liaison sensiblement adhésive avec la surface majeure qui est facilement éliminable sans endommager ni laisser un résidu substantiel de matériau de couche de nettoyage sur la surface majeure. Un nombre substantiel de particules qui étaient sur cette surface majeure sont capturées par la couche de nettoyage et peuvent être et éliminées avec celle-ci.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2382650JP2012513899US20110250401CN102326233KR1020110110784BRPI0923756