Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2010078405) METHOD OF MAKING AN EDGE-SEALED, ENCAPSULATED ENVIRONMENTALLY SENSITIVE DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/078405 International Application No.: PCT/US2009/069788
Publication Date: 08.07.2010 International Filing Date: 30.12.2009
IPC:
H01L 51/56 (2006.01) ,H01L 51/48 (2006.01) ,H01L 51/52 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
42
specially adapted for sensing infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation; specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
48
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
Applicants:
VITEX SYSTEMS, INC. [US/US]; 2184 Bering Drive San Jose, CA 95131, US (AllExceptUS)
SNU PRECISION CO., LTD. [KR/KR]; #201 Dong-a-town 1629-2, Bong-chun 7-dong Seoul 151-818, KR (AllExceptUS)
CHU, Xi [US/US]; US (UsOnly)
BURROWS, Paul, E. [GB/US]; US (UsOnly)
MAST, Eric [US/US]; US (UsOnly)
MARTIN, Peter, M. [US/US]; US (UsOnly)
GRAFF, Gordon, L. [US/US]; US (UsOnly)
GROSS, Mark, E. [US/US]; US (UsOnly)
BONHAM, Charles, C. [US/US]; US (UsOnly)
BENNETT, Wendy, D. [US/US]; US (UsOnly)
ROSENBLUM, Martin, Philip [US/US]; US (UsOnly)
KANG, Chang-ho [KR/KR]; KR (UsOnly)
TAE, Namgoong, Sung [KR/KR]; KR (UsOnly)
Inventors:
CHU, Xi; US
BURROWS, Paul, E.; US
MAST, Eric; US
MARTIN, Peter, M.; US
GRAFF, Gordon, L.; US
GROSS, Mark, E.; US
BONHAM, Charles, C.; US
BENNETT, Wendy, D.; US
ROSENBLUM, Martin, Philip; US
KANG, Chang-ho; KR
TAE, Namgoong, Sung; KR
HALL, Michael, G.; US
Agent:
PRIOR, Patricia, L.; Dinsmore & Shohl LLP One Dayton Centre, Suite 1300 One South Main Street Dayton, OH 45402-2023, US
Priority Data:
12/345,91230.12.2008US
Title (EN) METHOD OF MAKING AN EDGE-SEALED, ENCAPSULATED ENVIRONMENTALLY SENSITIVE DEVICE
(FR) PROCÉDÉ DE FABRICATION D'UN DISPOSITIF RESPECTUEUX DE L'ENVIRONNEMENT ENCAPSULÉ, À BORD SCELLÉ
Abstract:
(EN) A method of making an edge-sealed, encapsulated environmentally sensitive device. The method includes providing an environmentally sensitive device (940) on a substrate (905); depositing a decoupling layer (945) through one mask (910), the decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device; increasing the distance between the one mask (910) and the substrate (905); and depositing a first barrier layer (950) through the one mask (910), the first barrier layer adjacent to the decoupling layer, the first barrier layer having an area greater than the discrete area of the decoupling layer and covering the decoupling layer, the decoupling layer (945) being sealed between the edges of the first barrier layer (950) and the substrate (905) or an optional second barrier layer.
(FR) L'invention porte sur un procédé de fabrication d'un dispositif respectueux de l'environnement encapsulé, à bord scellé. Le procédé comprend la disposition d'un dispositif respectueux de l'environnement (940) sur un substrat (905) ; le dépôt d'une couche de découplage (945) à travers un masque (910), la couche de découplage étant adjacente au dispositif respectueux de l'environnement, la couche de découplage ayant une surface discrète et recouvrant le dispositif respectueux de l'environnement ; l'augmentation de la distance entre le masque (910) et le substrat (905) ; et le dépôt d'une première couche barrière (950) à travers le masque (910), la première couche barrière étant adjacente à la couche de découplage, la première couche barrière ayant une surface supérieure à la surface discrète de la couche de découplage et recouvrant la couche de découplage, la couche de découplage (945) étant scellée entre les bords de la première couche barrière (950) et du substrat (905) ou d'une seconde couche barrière facultative.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)