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1. (WO2010078021) REMOVABLE PACKAGE UNDERSIDE DEVICE ATTACH
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/078021 International Application No.: PCT/US2009/068440
Publication Date: 08.07.2010 International Filing Date: 17.12.2009
IPC:
H01L 23/12 (2006.01) ,H01L 23/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95052, US (AllExceptUS)
DESHPANDE, Anand [IN/IN]; IN (UsOnly)
NATARAJAN, Venkat [US/IN]; IN (UsOnly)
KABADI, Ashok [US/US]; US (UsOnly)
KINI, Vittal [US/US]; US (UsOnly)
Inventors:
DESHPANDE, Anand; IN
NATARAJAN, Venkat; IN
KABADI, Ashok; US
KINI, Vittal; US
Agent:
VINCENT, Lester, J.; Blakely Sokoloff Taylor & Zafman 1279 Oakmead Parkway Sunnyvale, California 94085, US
Priority Data:
12/317,85530.12.2008US
Title (EN) REMOVABLE PACKAGE UNDERSIDE DEVICE ATTACH
(FR) FIXATION INFÉRIEURE DE BOÎTIER AMOVIBLE
Abstract:
(EN) In some embodiments, a stacked package assembly may include a first socket defining an interior cavity, a first semiconductor device coupled to the first socket, a second socket positioned within the interior cavity of the first socket, and a second semiconductor device removably coupled to the second socket within the cavity of the first socket. The second socket may be positioned between the first semiconductor device and the second semiconductor device and provide an electrical connection between the first semiconductor device and the second semiconductor device. Other embodiments are disclosed and claimed.
(FR) L'invention concerne dans certains modes de réalisation un ensemble boîtier empilé pouvant comprendre un premier support définissant une cavité intérieure, un premier dispositif à semi-conducteur couplé au premier support, un second support positionné à l'intérieur de la cavité intérieure du premier support, et un second dispositif à semi-conducteur couplé de manière amovible au second support à l'intérieur de la cavité du premier support. Le second support peut être positionné entre le premier dispositif à semi-conducteur et le second dispositif à semi-conducteur et fournir une connexion électrique entre le premier dispositif à semi-conducteur et le second dispositif à semi-conducteur. D'autres modes de réalisation sont décrits et revendiqués.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
JP2012514333CN102301467KR1020110100306