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1. (WO2010077394) WAFER LEVEL OPTOELECTRONIC PACKAGE WITH FIBER SIDE INSERTION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/077394 International Application No.: PCT/US2009/056693
Publication Date: 08.07.2010 International Filing Date: 11.09.2009
IPC:
G02B 6/12 (2006.01) ,G02B 6/42 (2006.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10
of the optical waveguide type
12
of the integrated circuit kind
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
Applicants:
NATIONAL SEMICONDUCTOR CORPORATION [US/US]; 2900 Semiconductor Drive Santa Clara, CA 95051, US (AllExceptUS)
DARBINYAN, Artur [RU/US]; US (UsOnly)
NGUYEN, Luu [US/US]; US (UsOnly)
PODDAR, Anindya [US/US]; US (UsOnly)
Inventors:
DARBINYAN, Artur; US
NGUYEN, Luu; US
PODDAR, Anindya; US
Agent:
BEYER, Steve, D.; Beyer Law Group P.O. Box 1687 Cupertino, CA 95015-1687, US
Priority Data:
12/337,53317.12.2008US
Title (EN) WAFER LEVEL OPTOELECTRONIC PACKAGE WITH FIBER SIDE INSERTION
(FR) BOÎTIER OPTOÉLECTRONIQUE NIVEAU TRANCHE À INSERTION LATÉRALE DE FIBRES
Abstract:
(EN) Optoelectronic packages and wafer level techniques for forming optoelectronic packages are described. In accordance with one apparatus aspect of the invention, a pair of substrates are bonded together to form an optical coupler. A first one of the substrates has a recess that faces the second substrate to at least in part define a channel suitable for receiving an optical transmission medium. A photonic device is mounted on a mounting surface of the second substrate that is opposite its bonded surface. The photonic device faces the reflective surface and an optical path is formed between the channel and the photonic element that both reflects off of the reflective surface and passes through the second substrate. In some embodiments an integrated circuit device and/or solder bumps are also attached to the mounting surface and the second substrate has conductive traces thereon that electrically couple the various electrical components as appropriate (e.g., the photonic device, the integrated circuit device, the solder bumps and/or other components). The substrates may be formed from a wide variety of materials including, glass, plastic and silicon. In some embodiments, at least the second substrate is formed from an optically transparent material and the optical path passes directly though the optically transparent material. In a method aspect of the invention, a variety of wafer level methods for forming such devices are described.
(FR) L'invention concerne des boîtiers optoélectroniques et des techniques de niveau tranche pour former des boîtiers optoélectroniques. Selon un aspect d'un appareil de l'invention, une paire de substrats sont liés ensemble pour former un coupleur optique. Un premier substrat présente une encoche opposée au second substrat pour définir au moins partiellement un canal approprié pour recevoir un milieu de transmission optique. Un dispositif photonique est monté sur une surface de montage du second substrat qui est opposée à sa surface liée. Le dispositif photonique est opposé à la surface de réflexion et un chemin optique est formé entre le canal et l'élément photonique qui tous deux sont réfléchis sur la surface réfléchissante et traversent le second substrat. Dans certains modes de réalisation, un dispositif de circuit intégré et/ou des perles de soudure sont également fixés à la surface de montage et le second substrat comprend des traces conductrices qui couplent électroniquement les différents composés électriques comme il convient (par exemple, le dispositif photonique, le dispositif de circuit intégré, les perles de soudure et/ou d'autres composants). Les substrats peuvent être formés à partir d'une variété de matériaux comprenant, le verre, le plastique et le silicium. Dans certains modes de réalisation, au moins le second substrat est formé à partir d'un matériau optiquement transparent et le chemin optique traverse directement le matériau transparent. L'invention concerne également une variété de procédés de niveau tranche pour former lesdits dispositifs.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2359173