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1. (WO2010076960) SOLDER BALL ATTACHING METHOD AND SOLDERING METHOD USING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/076960 International Application No.: PCT/KR2009/006048
Publication Date: 08.07.2010 International Filing Date: 20.10.2009
IPC:
H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
고려대학교 산학협력단 KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION [KR/KR]; 서울시 성북구 안암동5가1 고려대학교 Korea University Anamdong 5-ga-1, Seongbuk-gu, Seoul 136-713, KR (AllExceptUS)
박제임스 정호 PAK, James Jung-Ho [US/KR]; KR (UsOnly)
장종현 CHANG, Jong-Hyeon [KR/KR]; KR (UsOnly)
홍장원 HONG, Jang-Won [KR/KR]; KR (UsOnly)
Inventors:
박제임스 정호 PAK, James Jung-Ho; KR
장종현 CHANG, Jong-Hyeon; KR
홍장원 HONG, Jang-Won; KR
Agent:
송경근 SONG, Kyeong-Keun; 서울시 서초구 서초동 1621-25 웰스빌딩 3층 3rd Floor, Wealth Building 1621-25 Seocho-dong, Seocho-gu Seoul 137-878, KR
Priority Data:
10-2008-010975806.11.2008KR
Title (EN) SOLDER BALL ATTACHING METHOD AND SOLDERING METHOD USING SAME
(FR) PROCÉDÉ DE FIXATION DE GLOBULE DE SOUDURE, ET PROCÉDÉ DE SOUDAGE CORRESPONDANT
(KO) 솔더볼 부착 방법 및 이를 이용한 솔더링 방법
Abstract:
(EN) Provided are a method for attaching a solder ball to a substrate and a soldering method using the same. The solder ball attaching method according to the present invention: forms a liquid droplet on the substrate, and attaches the solder ball to the substrate by self-arranging the solder ball in the liquid droplet. In other words, the method: forms a solder ball land by allowing a portion of the substrate for solder ball attachment to be selectively hydrophilic; self-arranges the solder ball in the liquid droplet on the solder ball land; then forms a solder bump through the attachment of the solder ball to the substrate by evaporating the liquid droplet and allowing the solder ball to re-flow. The invention is able to reduce the costs required for facility investment by enabling the installation of the solder ball only through surface treatment and the use of the liquid droplet without a separate device for solder ball adsorption. In addition, the invention allows simple and rapid process through three steps consisting of surface treatment, application of the liquid droplet, and attachment of the solder ball so that prompt action is rapidly taken for the solder ball installation process.
(FR) La présente invention concerne un procédé de fixation d'un globule de soudure à un substrat, et un procédé de soudage correspondant. Le procédé de fixation du globule de soudure de l'invention consiste à réaliser sur le substrat une gouttelette de liquide et à fixer au substrat le globule de soudure par organisation spontanée du globule de soudure dans la gouttelette de liquide. En l'occurrence, le procédé consiste d'abord à former une pastille de globule de soudure en rendant sélectivement hydrophile une partie du substrat destinée à la fixation du globule de soudures. Le procédé consiste ensuite à laisser le globule de soudure s'organiser spontanément dans la gouttelette de liquide sur la pastille de globule de soudure. Le procédé consiste enfin à former un bossage de soudure par fixation du globule de soudure sur le substrat, à savoir, par évaporation de la gouttelette de liquide, puis par refusion spontanée du globule de soudure. L'invention permet de réduire les coûts concernant les investissements en équipements car elle permet, d'une part de poser le globule de soudure par un simple traitement de surface, et d'autre part d'utiliser la gouttelette de liquide sans qu'il y ait besoin d'un autre dispositif pour l'adsorption des globules de soudure. En outre, l'invention permet un traitement simple et rapide en trois temps: traitement de surface, application de la gouttelette de liquide, et fixation du globule de soudure. On peut ainsi passer rapidement à la mise en place du globule de soudure.
(KO) 솔더볼(solder ball)을 기판에 부착하는 방법 및 이를 통해 솔더링(soldering)하는 방법을 제공한다. 본 발명에 따른 솔더볼 부착 방법은 기판 상에 액적을 형성하고 여기에 솔더볼을 자가정렬(self-arrangement)시켜 부착하게 된다. 이를테면 기판 상에 솔더볼을 부착하고자 하는 부위가 선택적으로 친수성을 띄게 하여 솔더볼 랜드(solder ball land)를 형성한 다음, 상기 솔더볼 랜드 상에 액적을 통해 상기 솔더볼을 자가정렬시킨다. 이후, 상기 액적을 증발시키고 상기 솔더볼을 리플로우(reflow)시켜 상기 솔더볼을 상기 기판에 부착하여 솔더 범프(solder bump)를 형성시킨다. 본 발명에 따르면, 솔더볼을 흡착시키는 장치를 이용하지 않고 단지 표면 처리와 액적을 이용하여 솔더볼의 장착이 가능하므로 설비 투자에 들어가는 비용을 절감할 수 있다. 또한, 표면 처리, 액적 도포, 솔더볼 부착의 3단계 공정으로 간단하고 신속하게 공정 진행할 수 있어 솔더볼 장착 과정에서의 빠른 대응이 가능하다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)