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1. (WO2010076863) SUBSTRATE TREATING SYSTEM AND SUBSTRATE TREATING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/076863 International Application No.: PCT/JP2009/069475
Publication Date: 08.07.2010 International Filing Date: 17.11.2009
IPC:
H01L 21/677 (2006.01) ,H01L 21/027 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants:
キヤノンアネルバ株式会社 CANON ANELVA CORPORATION [JP/JP]; 神奈川県川崎市麻生区栗木2-5-1 2-5-1 Kurigi, Asao-ku, Kawasaki-shi, Kanagawa 2158550, JP (AllExceptUS)
小林 浩仁 KOBAYASHI, Hirohito [JP/JP]; JP (UsOnly)
Inventors:
小林 浩仁 KOBAYASHI, Hirohito; JP
Agent:
岡部 正夫 OKABE, Masao; 東京都千代田区丸の内3-2-3 富士ビル602号室 No. 602, Fuji Bldg. , 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1000005, JP
Priority Data:
2008-33577829.12.2008JP
Title (EN) SUBSTRATE TREATING SYSTEM AND SUBSTRATE TREATING DEVICE
(FR) SYSTÈME DE TRAITEMENT DE SUBSTRAT ET DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理システム及び基板処理装置
Abstract:
(EN) A substrate treating system which can easily extend and modify a substrate treating module in accordance with the modification of treatment for a substrate.  The substrate treating system is comprised of a main device (100) and auxiliary devices (200, 300).  A transfer control portion (130) is comprised of a transfer procedure capturing portion (131), a destination judging portion (132), and a local transfer portion (133).  The transfer procedure capturing portion (131) captures destination specifying information containing at least a local address and additional information by which a substrate treating device to which the local address belongs can be specified, and the destination of a substrate can be uniquely specified among the main device (100) and the auxiliary devices (200, 300).  The destination judging portion (132) judges whether the destination of a substrate is the main device (100), the auxiliary device (200), or the auxiliary device (300) based on the destination specifying information captured from the transfer procedure capturing portion (131).  The local transfer portion (133) transfers a substrate to a process chamber connected to a transfer chamber of each device using a local address uniquely allocated to each device.
(FR) L'invention porte sur un système de traitement de substrat qui peut facilement étendre et modifier un module de traitement de substrat selon la modification de traitement pour un substrat. Le système de traitement de substrat est composé d'un dispositif principal (100) et de dispositifs auxiliaires (200, 300). Une partie de commande de transfert (130) est composée d'une partie d'acquisition de procédure de transfert (131), d'une partie de détermination de destination (132) et d'une partie de transfert local (133). La partie d'acquisition de procédure de transfert (131) acquiert des informations de spécification de destination contenant au moins une adresse locale et des informations supplémentaires par lesquelles un dispositif de traitement de substrat auquel appartient l'adresse locale peut être spécifié, et la destination d'un substrat peut être spécifiée de façon unique parmi le dispositif principal (100) et les dispositifs auxiliaires (200, 300). La partie de détermination de destination (132) détermine si la destination d'un substrat est le dispositif principal (100), le dispositif auxiliaire (200) ou le dispositif auxiliaire (300) sur la base des informations de spécification de destination acquises par la partie d'acquisition de procédure de transfert (131). La partie de transfert local (133) transfère un substrat vers une chambre de traitement communiquant avec une chambre de transfert de chaque dispositif à l'aide d'une adresse locale allouée de façon unique à chaque dispositif.
(JA) 本発明は、基板に対する処理内容の変更に応じて、容易に基板処理モジュールを拡張、変更が可能な基板処理システムを提供する。本発明の一実施形態は、メイン装置(100)、サブ装置(200、300)を有する基板処理システムである。搬送制御部(130)は、少なくともローカルアドレス、及び、当該ローカルアドレスの属する基板処理装置を特定可能な付加情報を含み、基板の搬送先をメイン装置(100)、サブ装置(200、300)内で一意に指定する搬送先指定情報を取得する搬送手順取得部(131)と、搬送手順取得部(131)により取得した搬送先指定情報に基づいて、基板の搬送先がメイン装置(100)、サブ装置(200)、またはサブ装置(300)のいずれかを判定可能な搬送先判定部(132)と、自装置内で一意に割り当てられたローカルアドレスを用いて、自装置の搬送チャンバに接続されるプロセスチャンバに基板を搬送させるローカル搬送部(133)とを有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JP4615071JPWO2010076863