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1. (WO2010076486) METHOD FOR MANUFACTURING A CONNECTOR ELEMENT INCLUDING A SUBSTRATE ON WHICH A LAYER OF GOLD IS DEPOSITED
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/076486 International Application No.: PCT/FR2009/052545
Publication Date: 08.07.2010 International Filing Date: 15.12.2009
IPC:
C23C 14/48 (2006.01) ,H01R 13/03 (2006.01) ,C25D 5/34 (2006.01) ,C25D 5/48 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
48
Ion implantation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
Applicants:
QUERTECH INGENIERIE [FR/FR]; 7 rue Alfred Kastler F-14000 Caen, FR (AllExceptUS)
BUSARDO, Denis [FR/FR]; FR (UsOnly)
Inventors:
BUSARDO, Denis; FR
Agent:
VIGNESOULT, Serge; Cabinet Plasseraud 52 rue de la Victoire F-75440 Paris Cedex 09, FR
Priority Data:
085866816.12.2008FR
Title (EN) METHOD FOR MANUFACTURING A CONNECTOR ELEMENT INCLUDING A SUBSTRATE ON WHICH A LAYER OF GOLD IS DEPOSITED
(FR) PROCEDE DE FABRICATION D'UN ELEMENT DE CONNECTEUR COMPRENANT UN SUBSTRAT SUR LEQUEL EST DEPOSEE UNE COUCHE D'OR.
Abstract:
(EN) The invention relates to a method for manufacturing a connector element including a substrate on which a layer of gold is deposited, which includes the following consecutive steps: a) providing a substrate (20); b) treating a surface of the substrate (20) by ion bombardment using an ion beam, wherein the ions are selected from among He, N, Ar, Kr, Xe; c) depositing a porous layer of gold (10) by electrolytic means onto the thus-treated surface of the substrate (20); d) treating the porosity of the porous layer of gold (10) by ion bombardment using an ion beam, wherein the ions are selected from among He, N, Ne, Ar, Kr, Xe. The method provides connector elements with enhanced properties.
(FR) Procédé de fabrication d'un élément de connecteur comprenant un substrat sur lequel est déposée une couche d'or qui comprend les étapes successives suivantes : a) approvisionnement d'un substrat (20); b) traitement par bombardement ionique grâce à un faisceau d'ions, d'une surface du substrat (20) où les ions sont choisis parmi He, N, Ar, Kr, Xe; c) dépôt d'une couche d'or poreuse (10) par voie électrolytique sur la surface ainsi traitée du substrat (20); d) traitement par bombardement ionique grâce à un faisceau d'ions de la porosité de la couche d'or poreuse (10) où les ions sont choisis parmi He, N, Ne, Ar, Kr, Xe. Il en résulte des éléments de connecteurs aux propriétés améliorées.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)