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1. (WO2010076422) METHOD FOR ASSEMBLING TWO SUBSTRATES IN A VACUUM AT A NEGATIVE TEMPERATURE, AND MACHINE FOR IMPLEMENTING SAID METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/076422 International Application No.: PCT/FR2009/001438
Publication Date: 08.07.2010 International Filing Date: 17.12.2009
IPC:
B23K 20/02 (2006.01) ,B29C 65/00 (2006.01) ,B32B 27/00 (2006.01) ,C09J 5/02 (2006.01) ,F16B 11/00 (2006.01) ,C23C 14/56 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
02
by means of a press
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
02
involving pretreatment of the surfaces to be joined
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
B
DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
11
Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
56
Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Applicants:
CAREWAVE SHIELDING TECHNOLOGIES (SAS) [FR/FR]; Technopole de Château Gombert Hotel Technologique F-13382 Marseille Cedex 13, FR (AllExceptUS)
PERRIN, Daniel [FR/FR]; FR (UsOnly)
Inventors:
PERRIN, Daniel; FR
Agent:
MAREK, Pierre; 28, rue de la Loge B.P. 42413 F-13215 Marseille Cedex 02, FR
Priority Data:
08/0717519.12.2008FR
Title (EN) METHOD FOR ASSEMBLING TWO SUBSTRATES IN A VACUUM AT A NEGATIVE TEMPERATURE, AND MACHINE FOR IMPLEMENTING SAID METHOD
(FR) PROCÉDÉ PERMETTANT D ' ASSEMBLER DEUX SUBSTRATS SOUS VIDE A TEMPÉRATURE NÉGATIVE ET MACHINE PERMETTANT LA MISE EN OEUVRE DE CE PROCÉDÉ
Abstract:
(EN) The invention relates to a method for assembling a first substrate (1) to a second substrate (2), characterised in that it comprises the following steps in a vacuum and at a negative temperature: depositing a thin film (5) of an assembling material onto a first surface (3) of the first substrate (1); depositing a thin film (6) of the same material onto a second surface (4) of the second substrate (2) having a shape complementary to that of the first surface (3); contacting said first surface (3) with said second surface (4); pressing said first surface (3) against said second surface (4). The invention also relates to a machine for implementing said method.
(FR) Procédé d'assemblage d'un premier substrat (1) avec un deuxième substrat (2) caractérisé en ce qu'il comprend les étapes suivantes réalisées sous vide et à température négative : dépôt d'une couche (5) mince de matériau d'assemblage, sur une première surface (3) du premier substrat (1), - dépôt d'une couche (6) mince de même matériau sur une deuxième surface (4) du deuxième substrat (2) de forme complémentaire à ladite première surface (3), - mise en contact de ladite première surface (3) et de ladite deuxième surface (4), - pressage de ladite première surface (3) contre ladite deuxième surface (4). Machine permettant la mise en œuvre dudit procédé.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)