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1. (WO2010076187) INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/076187 International Application No.: PCT/EP2009/067156
Publication Date: 08.07.2010 International Filing Date: 15.12.2009
IPC:
H01L 23/66 (2006.01) ,H01L 23/48 (2006.01) ,H01L 21/66 (2006.01) ,H01L 23/544 (2006.01) ,H01L 25/065 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
58
Structural electrical arrangements for semiconductor devices not otherwise provided for
64
Impedance arrangements
66
High-frequency adaptations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
544
Marks applied to semiconductor devices, e.g. registration marks, test patterns
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
Applicants:
STMICROELECTRONICS S.R.L. [IT/IT]; Via C. Olivetti, 2 I-Agrate Brianza, IT (AllExceptUS)
PAGANI, Alberto [IT/IT]; IT (UsOnly)
GIRLANDO, Giovanni [IT/IT]; IT (UsOnly)
Inventors:
PAGANI, Alberto; IT
GIRLANDO, Giovanni; IT
Agent:
JORIO, Paolo; Studio Torta S.r.l. Via Viotti, 9 I-10121 Torino, IT
Priority Data:
TO2008A 00101430.12.2008IT
Title (EN) INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION
(FR) DISPOSITIF ÉLECTRONIQUE INTÉGRÉ AVEC ANTENNE D'ÉMISSION-RÉCEPTION ET INTERCONNEXION MAGNÉTIQUE
Abstract:
(EN) An integrated electronic device (1) having a body (9) of semiconductor material and a first antenna (3;3a) which enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna (3b,3c). The integrated electronic device (1) has a first via (4;4a- 4d;50;50a;53) of magnetic material arranged at least in part inside the body (9), which forms, in use, a communication channel between the first antenna (3;3a) and the further antenna (3b,3c).
(FR) L'invention concerne un dispositif électronique intégré (1) comprenant un corps (9) en matériau semi-conducteur et une première antenne (3, 3a), qui permet un couplage magnétique ou électromagnétique du dispositif électronique intégré avec une antenne supplémentaire (3b, 3c). Le dispositif électronique intégré (1) comprend une première traversée (4, 4a, 4d ; 50, 50a, 53) de matériau magnétique, disposée au moins en partie à l'intérieur du corps (9), qui forme, lors de l'utilisation, un canal de communication entre la première antenne (3, 3a) et l'antenne supplémentaire (3b, 3c).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2382661