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1. (WO2010074842) STACKED POWER CONVERTER STRUCTURE AND METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074842 International Application No.: PCT/US2009/064748
Publication Date: 01.07.2010 International Filing Date: 17.11.2009
IPC:
H01L 23/12 (2006.01) ,H02M 3/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
3
Conversion of dc power input into dc power output
Applicants:
INTERSIL AMERICAS INC. [US/US]; 1001 Murphy Ranch Road Milpitas, California 95035, US (AllExceptUS)
BELL, David B. [US/US]; US (UsOnly)
HEBERT, Francois [CA/US]; US (UsOnly)
KELKAR, Nikhil [US/US]; US (UsOnly)
Inventors:
BELL, David B.; US
HEBERT, Francois; US
KELKAR, Nikhil; US
Agent:
FOGG, David, N.; Fogg & Powers LLC 5810 W. 78th Ste 100 Minneapolis, MN 55439, US
Priority Data:
61/140,61023.12.2008US
61/162,23220.03.2009US
Title (EN) STACKED POWER CONVERTER STRUCTURE AND METHOD
(FR) STRUCTURE ET PROCÉDÉ DE CONVERTISSEUR DE PUISSANCE EMPILÉ
Abstract:
(EN) A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a "PowerDie"). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.
(FR) L'invention concerne un convertisseur de puissance qui comprend un circuit de sortie comportant un dispositif côté haut et un dispositif côté bas pouvant être formés sur une seule puce ("PowerDie"). Ce convertisseur de puissance comprend de plus un circuit intégré (IC) de microrégisseur formé sur une puce différente, qui peut être couplé électriquement à la puce PowerDie et mise sous boîtier avec celle-ci. La puce PowerDie peut être fixée à une plage de puce d'une grille de connexion, et la puce IC de microrégisseur peut être fixée à une surface active de la première puce de sorte que la première puce est placée entre la puce IC de microrégisseur et la plage de puce.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020100074042KR1020100074043KR1020120031986CN101807543CN101807855CN101990709
MYPI 2010003690