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1. (WO2010074659) 3D MOLD FOR MANUFACTURE OF SUB-MICRON 3D STRUCTURES USING 2-D PHOTON LITHOGRAPHY AND NANOIMPRINTING AND PROCESS THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074659 International Application No.: PCT/SG2009/000443
Publication Date: 01.07.2010 International Filing Date: 23.11.2009
IPC:
G03F 1/00 (2006.01) ,G03F 7/24 (2006.01) ,G03F 7/40 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1
Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
24
Curved surfaces
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
40
Treatment after imagewise removal, e.g. baking
Applicants:
HELIOS APPLIED SYSTEMS PTE LTD [SG/SG]; 55 Kaki Bukit View Kaki Bukit Tech Park II Singapore 415976, SG (AllExceptUS)
KAN, Shyi-Herng [SG/SG]; SG (UsOnly)
Inventors:
KAN, Shyi-Herng; SG
Agent:
CHONG, Y F; PSA Building P. O. Box 0399 Singapore 911144, SG
Priority Data:
200809489-822.12.2008SG
Title (EN) 3D MOLD FOR MANUFACTURE OF SUB-MICRON 3D STRUCTURES USING 2-D PHOTON LITHOGRAPHY AND NANOIMPRINTING AND PROCESS THEREOF
(FR) MOULE EN 3D POUR LA FABRICATION DE STRUCTURES EN 3D DE TAILLE SUBMICRONIQUE À L'AIDE D'UNE LITHOGRAPHIE MULTIPHOTONS ET NANO-IMPRESSION ET LEUR PROCÉDÉ
Abstract:
(EN) A process to manufacture a 3D mold to fabricate a high-throughput and low cost sub-micron 3D structure product is disclosed. The process integrates use of 2-photon laser lithography and 3D write technology to make a 3D mold of each layer of the 3D structure product, and then use nanoimprinting to form a sheet of polymer film of each layer of the 3D structure from the said 3D mold of that layer. Each layer of the sheet of polymer film is then fabricated into the sub-micron 3D structure product. The 3D mold of each layer of a high-throughput and low cost sub-micron 3D structure product, is further used to make master molds which is then used to form a sheet of polymer film of each layer of the 3D structure to fabricate the sub-micron 3D structure product. Applications using this process are also disclosed.
(FR) La présente invention concerne un procédé pour fabriquer un moule en 3D afin de donner un produit à structure en 3D de taille submicronique à haut rendement et faible coût. Le procédé comprend l'utilisation d'une lithographie laser multiphotons et d'une technologie d'écriture en 3D pour fabriquer un moule en 3D de chaque couche du produit à structure en 3D, puis utilise la nano-impression pour former une feuille d'un film polymère de chaque couche de la structure en 3D à partir dudit moule en 3D de cette couche. Chaque couche de la feuille de film polymère est ensuite fabriquée dans le produit à structure en 3D de taille submicronique. Le moule en 3D de chaque couche d'un produit à structure en 3D de taille submicronique à haut rendement et faible coût est ensuite utilisé pour fabriquer des moules maîtres qui sont ensuite utilisés pour former une feuille de film polymère de chaque couche de la structure en 3D pour fabriquer le produit à structure en 3D de taille submicronique. L'invention concerne également des applications utilisant ce procédé.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
JP2011523199EP2361402US20110046764CN101971092CN102981358KR1020100119793
US09272474