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1. (WO2010074649) VIA STRUCTURE AND METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074649 International Application No.: PCT/SE2009/051496
Publication Date: 01.07.2010 International Filing Date: 23.12.2009
IPC:
H01L 23/522 (2006.01) ,B61B 7/00 (2006.01) ,B81C 1/00 (2006.01) ,H01L 21/768 (2006.01) ,G02B 26/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
52
Arrangements for conducting electric current within the device in operation from one component to another
522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
B PERFORMING OPERATIONS; TRANSPORTING
61
RAILWAYS
B
RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
7
Rope railway systems with suspended flexible tracks
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26
Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
08
for controlling the direction of light
Applicants:
SILEX MICROSYSTEMS AB [SE/SE]; P.O. Box 595 S-175 26 Järfälla, SE (AllExceptUS)
EBEFORS, Thorbjörn [SE/SE]; SE (UsOnly)
KÄLVESTEN, Edvard [SE/SE]; SE (UsOnly)
ÅGREN, Peter [SE/SE]; SE (UsOnly)
SVEDIN, Niklas [SE/SE]; SE (UsOnly)
Inventors:
EBEFORS, Thorbjörn; SE
KÄLVESTEN, Edvard; SE
ÅGREN, Peter; SE
SVEDIN, Niklas; SE
Agent:
BRANN AB; P.O. Box 17192 S-104 62 Stockholm, SE
Priority Data:
0802663-523.12.2008SE
Title (EN) VIA STRUCTURE AND METHOD THEREOF
(FR) STRUCTURE DE TROU D'INTERCONNEXION ET PROCÉDÉ ASSOCIÉ
Abstract:
(EN) The invention relates to a layered micro-electronic and/or micro-mechanic structure, comprising at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.
(FR) La présente invention concerne une structure microélectronique et/ou micromécanique en couches, comprenant au moins trois couches électriquement conductrices alternées et des couches isolantes situées entre les couches conductrices. L'invention concerne également un trou d'interconnexion ménagé dans une première couche extérieure, ledit trou d'interconnexion comprenant une connexion conductrice isolée constituée d'un matériau de plaquette natif traversant la couche, une fiche électriquement conductrice s'étendant à travers les autres couches et pénétrant dans ledit trou d'interconnexion ménagé dans la première couche extérieure afin de créer une conductivité à travers les couches, et une enceinte isolante entourant ladite fiche conductrice dans au moins une couche sélectionnée desdites autres couches afin d'isoler ladite fiche du matériau présent dans ladite couche sélectionnée. Elle concerne également un dispositif micro-électronique et/ou micromécanique comprenant un organe mobile disposé au-dessus d'une cavité de façon à pouvoir se déplacer dans au moins une direction. Le dispositif présente une structure en couches conforme à l'invention. L'invention concerne également des procédés de fabrication d'une structure MEMS en couches de ce type.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2377154EP2383601EP2381289JP2012513621US20120018852US20120018898
US20120019886CN102362346US20140063580KR1020110110771JP2015147295KR1020160015392
JP2015146018