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1. (WO2010074518) DUAL-LAYER ADHESIVE FILM FOR SEMICONDUCTOR AND DIE BONDING FILM INCLUDING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074518 International Application No.: PCT/KR2009/007746
Publication Date: 01.07.2010 International Filing Date: 23.12.2009
IPC:
C09J 7/02 (2006.01) ,C09J 163/00 (2006.01) ,C09J 11/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
Applicants:
제일모직 주식회사 CHEIL INDUSTRIES INC. [KR/KR]; 경상북도 구미시 공단동 290 290 Gongdan-dong Gumi-si Gyeongsangbuk-do 730-710, KR (AllExceptUS)
송기태 SONG, Ki Tae [KR/KR]; KR (UsOnly)
최한님 CHOI, Han Nim [KR/KR]; KR (UsOnly)
정철 JEONG, Chul [KR/KR]; KR (UsOnly)
임수미 IM, Su Mi [KR/KR]; KR (UsOnly)
김상진 KIM, Sang Jin [KR/KR]; KR (UsOnly)
홍용우 HONG, Yong Woo [KR/KR]; KR (UsOnly)
박백성 PARK, Baek Soung [KR/KR]; KR (UsOnly)
Inventors:
송기태 SONG, Ki Tae; KR
최한님 CHOI, Han Nim; KR
정철 JEONG, Chul; KR
임수미 IM, Su Mi; KR
김상진 KIM, Sang Jin; KR
홍용우 HONG, Yong Woo; KR
박백성 PARK, Baek Soung; KR
Agent:
특허법인아주양헌 AJU KIM CHANG & LEE; 서울 강남구 역삼동 648번지 허바허바빌딩 6층 6th Floor, Hubbahubba Building 648, Yeoksam-dong, Gangnam-gu Seoul 135-911, KR
Priority Data:
10-2008-013384924.12.2008KR
Title (EN) DUAL-LAYER ADHESIVE FILM FOR SEMICONDUCTOR AND DIE BONDING FILM INCLUDING THE SAME
(FR) FILM ADHÉSIF BICOUCHE POUR SEMI-CONDUCTEURS ET FILM DE REPORT DE PUCE LE COMPRENANT
(KO) 반도체용 복층구조 접착 필름 및 이를 포함하는 다이본딩필름
Abstract:
(EN) The present invention relates to an adhesive layer for a semiconductor and a dual-layer adhesive film prepared by using the same, wherein in order to solve the problem of deteriorating reliability of a semiconductor chip caused by migration of transition metals and transition metal ions, bonding with transition metal ions is used or transition metal ions are oxidized or reduced, and an adhesive layer including a functional group that can remarkably reduce the mobility of a transition method is used; an adhesive film is further formed that enables the flow properties to be assured, taking the subsequent wire bonding process into consideration, so that stability of semiconductor operation may be enhanced, dimensional stability of the adhesive film assured, tensile strength increased, and reliability of the semiconductor chip bonding process enhanced.
(FR) La présente invention concerne une couche adhésive pour semi-conducteurs et un film adhésif bicouche préparé à partir de celle-ci. Pour résoudre le problème de détérioration de la fiabilité d'une puce semi-conductrice causée par la migration des métaux de transition et des ions de métaux de transition, ladite couche adhésive comporte un groupe fonctionnel qui réduit de façon remarquable la mobilité de ces métaux et ions. Ledit film adhésif permet en outre d'assurer les propriétés d'écoulement lors du procédé de microcâblage consécutif, de sorte que la stabilité du fonctionnement du semi-conducteur est améliorée, la stabilité dimensionnelle du film adhésif est assurée, la résistance à la traction est accrue, et la fiabilité du procédé de report de puce est augmentée.
(KO) 본 발명은 반도체용 접착층 및 이를 이용하여 제조된 복층구조 접착 필름에 관한 것으로, 전이금속 및 전이금속 이온의 이동으로 인해 야기되는 반도체 칩의 신뢰성 저하를 해결하기 위하여, 전이금속 이온과 결합을 통하여 또는 전이금속 이온을 산화 또는 환원시키고, 전이금속의 이동도를 현저히 감소시킬 수 있는 기능기를 포함하는 접착층을 사용하되, 후속의 와이어 본딩 공정을 고려하여 유동성을 확보할 수 있는 접착필름을 더 형성함으로써, 반도체 작동의 안정성을 높일 수 있고, 접착 필름의 치수 안정성을 확보함과 동시에 인장강도를 증가시켜 반도체 칩 접합 공정의 신뢰도를 높일 수 있도록 하는 발명에 관한 것이다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)