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1. (WO2010074371) CHIP-ON-BOARD LED PACKAGE AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074371 International Application No.: PCT/KR2009/002382
Publication Date: 01.07.2010 International Filing Date: 06.05.2009
IPC:
H01L 33/64 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
64
Heat extraction or cooling elements
Applicants:
루미마이크로 주식회사 LUMIMICRO CORP., LTD. [KR/KR]; 경기도 수원시 영통구 원천동 362-43 362-43, Woncheon-dong, Yeongtong-gu, Suwon-si Gyeonggi-do 443-823, KR (AllExceptUS)
김한도 KIM, Han Do [KR/KR]; KR (UsOnly)
윤정현 YOON, Jung Hyun [KR/KR]; KR (UsOnly)
김천수 KIM, Chun Soo [KR/KR]; KR (UsOnly)
Inventors:
김한도 KIM, Han Do; KR
윤정현 YOON, Jung Hyun; KR
김천수 KIM, Chun Soo; KR
Agent:
특허법인 명문 MYUNG MOON IP & LAW FIRM; 서울시 강남구 역삼1동 642-9 송촌빌딩 8층 8F, Songchon Bldg., 642-9 Yeoksam 1-dong, Gangnam-gu Seoul 135-910, KR
Priority Data:
10-2008-013475426.12.2008KR
Title (EN) CHIP-ON-BOARD LED PACKAGE AND MANUFACTURING METHOD THEREOF
(FR) ENSEMBLE DE DEL À MONTAGE DIRECT DES PUCES ET SON PROCÉDÉ DE FABRICATION
(KO) 칩온보드형 발광 다이오드 패키지 및 그것의 제조 방법
Abstract:
(EN) The present invention relates to a chip-on-board LED package that comprises: a metallic heatsink plate; a chip mounted on the metallic heatsink plate; phosphors applied on the chip; and a heatsink insulator provided on the metallic heatsink plate, and including a lead electrode therein that is electrically connected to the chip and passes through the heatsink insulator. Therefore, the chip-on-board LED package has improved heatsink performance, thereby realizing a high-luminance LED.
(FR) La présente invention concerne un ensemble de DEL à montage direct des puces qui comprend : une plaque de dissipation thermique métallique; une puce montée sur la plaque de dissipation thermique métallique; des substances fluorescentes appliquées sur la puce; et un isolant de dissipateur thermique sur la plaque de dissipation thermique métallique, à l'intérieur de laquelle se trouve une électrode conductrice qui est électriquement connectée à la puce et traverse l'isolant de dissipateur thermique. L'invention permet donc la configuration d'une DEL à forte luminance en améliorant les performances de dissipation thermique.
(KO) 본 발명은, 칩온보드형 발광 다이오드 패키지에 관한 것으로서, 금속 방열 플레이트와; 상기 금속 방열 플레이트 상에 실장된 칩과; 상기 칩 위에 도포된 형광체와; 상기 금속 방열 플레이트의 상부에 구비되고, 그 내부에 상기 칩과 전기적으로 연결되는 리드 전극이 통과하도록 이루어진 방열성 절연체를 포함하여 구성됨으로써, 방열 성능을 향상시켜 고휘도의 LED 구현이 가능해지도록 하는 효과를 제공하게 된다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)