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1. (WO2010074197) PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074197 International Application No.: PCT/JP2009/071533
Publication Date: 01.07.2010 International Filing Date: 25.12.2009
IPC:
G03F 7/027 (2006.01) ,C08F 290/06 (2006.01) ,C08G 73/14 (2006.01) ,G03F 7/004 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290
Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02
on to polymers modified by introduction of unsaturated end groups
06
Polymers provided for in subclass C08G52
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
14
Polyamide-imides
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
Applicants:
味の素株式会社 AJINOMOTO CO., INC. [JP/JP]; 東京都中央区京橋一丁目15番1号 15-1, Kyobashi 1-chome, Chuo-ku, Tokyo 1048315, JP (AllExceptUS)
塩尻 栄二 SHIOJIRI, Eiji [JP/JP]; JP (UsOnly)
勝部 正治 KATSUBE, Masaharu [JP/JP]; JP (UsOnly)
Inventors:
塩尻 栄二 SHIOJIRI, Eiji; JP
勝部 正治 KATSUBE, Masaharu; JP
Agent:
高島 一 TAKASHIMA, Hajime; 大阪府大阪市中央区伏見町四丁目1番1号 明治安田生命大阪御堂筋ビル Meiji Yasuda Seimei Osaka Midosuji Bldg., 1-1, Fushimimachi 4-chome, Chuo-ku, Osaka-shi, Osaka 5410044, JP
Priority Data:
2008-33086725.12.2008JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE
(JA) 感光性樹脂組成物
Abstract:
(EN) Disclosed is a photosensitive resin composition which has excellent photocuring properties, excellent developing properties, and excellent insulating reliability in a fine-pitch wiring pattern and also has good plating resistance. The photosensitive resin composition comprises (a) a radical-polymerizable compound containing a carboxyl group, (b) a polyimide resin, (c) an epoxy resin, (d) a photopolymerization initiator, and (e) a reactive diluent.  Preferably, the polyimide resin (b) to be used is a polyimide resin having an isocyanurate ring, a cyclic aliphatic structure and an imide ring.
(FR) La présente invention a pour objet une composition de résine photosensible qui possède d'excellentes propriétés de photodurcissement, d'excellentes propriétés de développement, et une excellente fiabilité d'isolation dans un schéma de câblage à pas fin, et possède également une bonne résistance au placage. La composition de résine photosensible comprend (a) un composé polymérisable par radicaux contenant un groupe carboxyle, (b) une résine polyimide, (c) une résine époxy, (d) un initiateur de photopolymérisation, et (e) un diluant réactif. De préférence, la résine polyimide (b) destinée à être utilisée est une résine polyimide ayant un cycle isocyanurate, une structure aliphatique cyclique et un cycle imide.
(JA)  光硬化性、現像性、及び狭ピッチ配線パターンでの絶縁信頼性に優れ、さらに耐めっき性も良好な感光性樹脂組成物を提供すること。 本発明の感光性樹脂組成物は、(a)カルボキシル基含有ラジカル重合性化合物、(b)ポリイミド樹脂、(c)エポキシ化合物、(d)光重合開始剤及び(e)反応性希釈剤を含む組成物であり、好適には、(b)ポリイミド樹脂に、イソシアヌレート環と環式脂肪族構造とイミド環とを有するポリイミド樹脂を使用した組成物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2010074197