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1. (WO2010074085) RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074085 International Application No.: PCT/JP2009/071334
Publication Date: 01.07.2010 International Filing Date: 22.12.2009
IPC:
C08G 59/50 (2006.01) ,C08G 59/68 (2006.01) ,C08J 5/24 (2006.01) ,C08K 3/00 (2006.01) ,C08K 5/50 (2006.01) ,C08L 63/00 (2006.01) ,C08L 79/00 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/46 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68
characterised by the catalysts used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
50
Phosphorus bound to carbon only
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
住友ベークライト株式会社 SUMITOMO BAKELITE COMPANY, LTD. [JP/JP]; 東京都品川区東品川2丁目5番8号 5-8, Higashishinagawa 2-chome, Shinagawa-ku, Tokyo 1400002, JP (AllExceptUS)
梅野 邦治 UMENO, Kuniharu [JP/JP]; JP (UsOnly)
Inventors:
梅野 邦治 UMENO, Kuniharu; JP
Agent:
岸本 達人 KISHIMOTO, Tatsuhito; 東京都中央区京橋一丁目16番10号 オークビル京橋3階 東京セントラル特許事務所内 c/o TOKYO CENTRAL PATENT FIRM, 3rd Floor, Oak Building Kyobashi, 16-10, Kyobashi 1-chome, Chuou-ku, Tokyo 1040031, JP
Priority Data:
2008-32901225.12.2008JP
Title (EN) RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE, PRÉIMPRÉGNÉ, FEUILLE DE RÉSINE, STRATIFIÉ À REVÊTEMENT MÉTALLIQUE, CARTE DE CÂBLAGE IMPRIMÉ, CARTE DE CÂBLAGE IMPRIMÉ MULTICOUCHE ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 樹脂組成物、プリプレグ、樹脂シート、金属張積層板、プリント配線板、多層プリント配線板、及び半導体装置
Abstract:
(EN) Disclosed is a resin composition which, when used in a multilayer printed wiring board which requires fine wiring work, exhibits a low thermal expansion coefficient, as well as higher heat-resistance, resistance to burning, and insulation reliability than with the prior art. Further disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board, and a semiconductor device which use said resin composition. The resin composition contains as the essential components (A) an epoxy resin, (B) a cyanate resin, and (C) an onium salt compound.
(FR) L'invention porte sur une composition de résine qui, lorsqu'elle est utilisée dans une carte de câblage imprimé multicouche qui nécessite un travail de câblage fin, présente un faible coefficient de dilatation thermique, ainsi que des propriétés supérieures en termes de résistance à la chaleur et à la combustion, et de fiabilité d'isolation par rapport à l'état antérieur de la technique. L'invention porte en outre sur un préimprégné, sur une feuille de résine, sur un stratifié à revêtement métallique, sur une feuille de câblage imprimé, sur une feuille de câblage imprimé multicouche et sur un dispositif semi-conducteur qui utilisent ladite composition de résine. La composition de résine contient, en tant que composants essentiels, (A) une résine époxy, (B) une résine de cyanate et (C) un composé de sel d'onium.
(JA) 本発明は、微細配線加工を要求される多層プリント配線板に用いた際に、低熱膨張率で、さらに従来よりも高い耐熱性、耐燃性、優れた絶縁信頼性を発現できる樹脂組成物、当該樹脂組成物を用いたプリプレグ、樹脂シート、金属張積層板、プリント配線板、多層プリント配線板、及び半導体装置を提供する。本発明の樹脂組成物は、(A)エポキシ樹脂、(B)シアネート樹脂、及び(C)オニウム塩化合物を必須成分として含有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2010074085US20110255258CN102264793KR1020110117061MYPI 2011002883