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1. (WO2010074067) ELECTROLESS TIN OR TIN-ALLOY PLATING SOLUTION AND ELECTRONIC PART WITH TIN OR TIN-ALLOY COATING FILM FORMED FROM THE PLATING SOLUTION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074067 International Application No.: PCT/JP2009/071301
Publication Date: 01.07.2010 International Filing Date: 22.12.2009
Chapter 2 Demand Filed: 29.06.2010
IPC:
C23C 18/31 (2006.01) ,C23C 18/48 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
48
Coating with alloys
Applicants:
JX日鉱日石金属株式会社 JX NIPPON MINING & METALS CORPORATION [JP/JP]; 東京都千代田区大手町二丁目6番3号 6-3, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008164, JP (AllExceptUS)
小林 弘典 KOBAYASHI, Hironori [JP/JP]; JP (UsOnly)
難波 累 NANBA, Rui [JP/JP]; JP (UsOnly)
大内 高志 OUCHI, Takashi [JP/JP]; JP (UsOnly)
Inventors:
小林 弘典 KOBAYASHI, Hironori; JP
難波 累 NANBA, Rui; JP
大内 高志 OUCHI, Takashi; JP
Agent:
酒井 正己 SAKAI, Masami; 東京都港区赤坂4丁目13番5号赤坂オフィスハイツ Akasaka Office Heights, 13-5, Akasaka 4-chome, Minato-ku, Tokyo 1070052, JP
Priority Data:
2008-32731424.12.2008JP
Title (EN) ELECTROLESS TIN OR TIN-ALLOY PLATING SOLUTION AND ELECTRONIC PART WITH TIN OR TIN-ALLOY COATING FILM FORMED FROM THE PLATING SOLUTION
(FR) SOLUTION DE DÉPÔT SANS COURANT D'ÉTAIN OU D'ALLIAGE D'ÉTAIN, ET PIÈCE ÉLECTRONIQUE RECOUVERTE D'UN FILM D'ÉTAIN OU D'ALLIAGE D'ÉTAIN FORMÉ AVEC CETTE SOLUTION
(JA) 無電解錫又は錫合金めっき液及び該めっき液を用いて錫又は錫合金被膜を形成した電子部品
Abstract:
(EN) An electroless tin or tin-alloy plating solution which is less apt to penetrate into the interface between a cover lay film or solder resist and copper or a copper alloy, and can form a deposit film having satisfactory wettability by a solder and satisfactory reliability of connection between the base and the solder. The electroless tin or tin-alloy plating solution contains at least a tin salt, a complexing agent, and an acid, and is characterized by containing an azole compound or azine compound having three or more nitrogen atoms in the ring.
(FR) La solution de dépôt sans courant d'étain ou d'alliage d'étain ci-décrite est moins susceptible de pénétrer l'interface entre une couche de fermeture ou une épargne de soudage et du cuivre ou un alliage de cuivre, et peut former un film présentant une mouillabilité satisfaisante par une brasure tendre et une bonne fiabilité de connexion entre la base et la brasure. Cette solution contient au moins un sel d'étain, un agent complexant, un acide, et un composé azole ou azine avec au moins trois atomes d'azote sur le cycle.
(JA)  カバーレイフィルムやソルダーレジストと銅又は銅合金界面へのめっき液の浸入が少なく、また、はんだ濡れ性が良好であり、基材とはんだとの接合信頼性も良好なめっき被膜を形成することが可能な無電解錫又は錫合金めっき液を提供する。 少なくとも錫塩、錯化剤、酸を含む無電解錫又は錫合金めっき液において、環内に窒素原子を3つ以上含むアゾール化合物又はアジン化合物を含有することを特徴とする無電解錫又は錫合金めっき液である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2010074067