Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2010074056) FLEXIBLE LAMINATE AND FLEXIBLE ELECTRONIC CIRCUIT SUBSTRATE FORMED USING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074056 International Application No.: PCT/JP2009/071285
Publication Date: 01.07.2010 International Filing Date: 22.12.2009
IPC:
B32B 15/08 (2006.01) ,B32B 15/088 (2006.01) ,H05K 1/03 (2006.01) ,H05K 1/09 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
JX日鉱日石金属株式会社 JX Nippon Mining & Metals Corporation [JP/JP]; 東京都千代田区大手町二丁目6番3号 6-3, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008164, JP (AllExceptUS)
牧野 修仁 MAKINO Nobuhito [JP/JP]; JP (UsOnly)
稲住 肇 INAZUMI Hajime [JP/JP]; JP (UsOnly)
吉田 拓 YOSHIDA Taku [JP/JP]; JP (UsOnly)
Inventors:
牧野 修仁 MAKINO Nobuhito; JP
稲住 肇 INAZUMI Hajime; JP
吉田 拓 YOSHIDA Taku; JP
Agent:
小越 勇 OGOSHI Isamu; 東京都港区虎ノ門3丁目1番10号 第2虎ノ門電気ビル5階 小越国際特許事務所 OGOSHI International Patent Office Daini-Toranomon Denki Bldg., 5F, 3-1-10 Toranomon, Minato-ku, Tokyo 1050001, JP
Priority Data:
2008-33456526.12.2008JP
2009-02820310.02.2009JP
Title (EN) FLEXIBLE LAMINATE AND FLEXIBLE ELECTRONIC CIRCUIT SUBSTRATE FORMED USING THE SAME
(FR) STRATIFIE SOUPLE ET SUBSTRAT DE CIRCUIT ELECTRONIQUE SOUPLE FORME AU MOYEN DE CE STRATIFIE
(JA) フレキシブルラミネート及び該ラミネートを用いて形成したフレキシブル電子回路基板
Abstract:
(EN) Provided is an adhesive-free flexible laminate formed from polyimide film, wherein at least one surface has been plasma treated; a tie coat layer formed on the surface of the plasma-treated polyimide film; a metal seed layer, which comprises one of either copper or copper alloy and is formed on the tie coat layer; and a metal conductor layer, which comprises one of either copper or copper alloy and is formed on the metal seed layer. The atomic percentage of Cu mixed in the tie coat layer is 0.5 at% or less. As a result, it is possible to effectively suppress a reduction in peeling strength when the flexible laminate (particularly a laminate having two metalizing layers) is produced.
(FR) L'invention concerne un stratifié souple exempt d'adhésif comprenant : un film polyimide dont au moins une surface a été traitée par plasma; une couche d'accrochage formée sur la surface du film polyimide traité par plasma; une couche de germe métallique contenant du cuivre ou un alliage de cuivre, formée sur la couche d'accrochage; et une couche de conducteur métallique contenant du cuivre ou un alliage de cuivre, formée sur la couche de germe métallique. Le pourcentage atomique de Cu mélangé dans la couche d'accrochage est de 0,5% atomiques ou inférieur. La présente invention permet ainsi de supprimer efficacement une réduction de la résistance au décollement lors de la production du stratifié souple (en particulier d'un stratifié comprenant deux couches de métallisation).
(JA)  少なくとも一方の面をプラズマ処理したポリイミドフィルム、プラズマ処理されたポリイミドフィルムの面に形成したタイコート層、タイコート層上に形成した銅又は銅合金のいずれか1種からなる金属シード層、さらに金属シード層上に形成した銅又は銅合金のいずれか1種からなる金属導体層からなる無接着剤フレキシブルラミネートであって、前記タイコート層中の混入Cuの原子分率が0.5at%以下であることを特徴とする無接着剤フレキシブルラミネート。フレキシブルラミネート(特に、二層メタライジング積層体)を製作する場合に、ピール強度の低下を効果的に抑制できるフレキシブルラミネートを提供することを課題とする。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2371535SG171974US20120012367CN102264538KR1020110089368