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1. (WO2010074028) LIGHT EMISSION DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074028 International Application No.: PCT/JP2009/071239
Publication Date: 01.07.2010 International Filing Date: 21.12.2009
IPC:
H01L 33/20 (2010.01) ,F21S 2/00 (2006.01) ,F21V 19/00 (2006.01) ,F21Y 101/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
S
NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF
2
Systems of lighting devices, not provided for in main groups F21S4/-F21S10/119
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19
Fastening of light sources or lamp holders
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
101
Point-like light sources
02
Miniature, e.g. light emitting diodes (LED)
Applicants:
パナソニック電工株式会社 PANASONIC ELECTRIC WORKS CO., LTD. [JP/JP]; 大阪府門真市大字門真1048番地 1048, Oaza-Kadoma, Kadoma-shi, Osaka 5718686, JP (AllExceptUS)
村井 章彦 MURAI, Akihiko [JP/JP]; JP (UsOnly)
Inventors:
村井 章彦 MURAI, Akihiko; JP
Agent:
西川 惠清 NISHIKAWA, Yoshikiyo; 大阪府大阪市北区梅田1丁目12番17号 梅田スクエアビル9階 北斗特許事務所 Hokuto Patent Attorneys Office, Umeda Square Bldg. 9F, 12-17, Umeda 1-chome, Kita-ku, Osaka-shi, Osaka 5300001, JP
Priority Data:
2008-32653222.12.2008JP
Title (EN) LIGHT EMISSION DEVICE
(FR) DISPOSITIF ÉLECTROLUMINESCENT
(JA) 発光装置
Abstract:
(EN) A light emission device includes a substrate and an LED chip mounted on the substrate.  The chip includes: a body having a base and formed by a transparent conductor protruding from the base while tapered from the base; a light source formed by a plurality of light emission units formed separately on the base; a first terminal formed on the base; and a plurality of second terminals each formed on the light emission units.  The conductor pattern on the substrate includes a first conductor electrically connected to the first terminal and a plurality of second conductors electrically connected to the respective second terminals.
(FR) L'invention porte sur un dispositif électroluminescent qui comprend un substrat et une puce à diode électroluminescente (DEL) montée sur le substrat. La puce comprend : un corps comprenant une base et formé par un conducteur transparent faisant saillie de la base tout en étant à section décroissante à partir de la base ; une source lumineuse formée par une pluralité d'unités électroluminescentes formées séparément sur la base ; une première borne formée sur la base ; et une pluralité de deuxièmes bornes formées chacune sur les unités électroluminescentes. Le motif conducteur sur le substrat comprend un premier conducteur électriquement connecté à la première borne et une pluralité de deuxièmes conducteurs électriquement connectés aux deuxièmes bornes respectives.
(JA)  発光装置は、基板、及び該基板に搭載されるLEDチップを含む。該チップは、ベースを備え該ベースから突出して該ベースから先細りになる透明導電体からなるボディと、該ベース上に別々に形成される複数の発光部からなる光源と、該ベース上に形成される第1端子と、該複数の発光部上にそれぞれ形成される複数の第2端子とを含む。該基板の導体パターンは、該第1端子と電気的に接続される第1導体と、該複数の第2端子とそれぞれ電気的に接続される複数の第2導体とを含む。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US20110248239KR1020110099751