Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2010074026) COMPOSITION FOR FORMING HIGH-DIELECTRIC FILM FOR FILM CAPACITOR
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/074026 International Application No.: PCT/JP2009/071236
Publication Date: 01.07.2010 International Filing Date: 21.12.2009
IPC:
H01G 4/20 (2006.01) ,C08J 5/18 (2006.01) ,C08K 9/04 (2006.01) ,C08L 27/12 (2006.01) ,C08L 101/00 (2006.01) ,H01B 3/00 (2006.01) ,H01G 4/18 (2006.01) ,H01B 17/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
018
Dielectrics
20
using combinations of dielectrics from more than one of groups H01G4/02-H01G4/06115
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9
Use of pretreated ingredients
04
Ingredients treated with organic substances
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
12
containing fluorine atoms
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3
Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
018
Dielectrics
06
Solid dielectrics
14
Organic dielectrics
18
of synthetic material, e.g. derivatives of cellulose
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
17
Insulators or insulating bodies characterised by their form
56
Insulating bodies
Applicants:
ダイキン工業株式会社 DAIKIN INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市北区中崎西二丁目4番12号 梅田センタービル Umeda Center Building, 4-12, Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-shi, Osaka 5308323, JP (AllExceptUS)
横谷 幸治 YOKOTANI, Kouji [JP/JP]; JP (UsOnly)
太田 美晴 OTA, Miharu [JP/JP]; JP (UsOnly)
立道 麻有子 TATEMICHI, Mayuko [JP/JP]; JP (UsOnly)
小松 信之 KOMATSU, Nobuyuki [JP/JP]; JP (UsOnly)
向井 恵吏 MUKAI, Eri [JP/JP]; JP (UsOnly)
高 明天 KOH, Meiten [KR/JP]; JP (UsOnly)
Inventors:
横谷 幸治 YOKOTANI, Kouji; JP
太田 美晴 OTA, Miharu; JP
立道 麻有子 TATEMICHI, Mayuko; JP
小松 信之 KOMATSU, Nobuyuki; JP
向井 恵吏 MUKAI, Eri; JP
高 明天 KOH, Meiten; JP
Agent:
朝日奈 宗太 ASAHINA, Sohta; 大阪府大阪市中央区谷町二丁目2番22号 NSビル NS Building, 2-22, Tanimachi 2-chome, Chuo-ku, Osaka-shi, Osaka 5400012, JP
Priority Data:
2008-32610422.12.2008JP
Title (EN) COMPOSITION FOR FORMING HIGH-DIELECTRIC FILM FOR FILM CAPACITOR
(FR) COMPOSITION POUR FORMER UN FILM À CONSTANTE DIÉLECTRIQUE ÉLEVÉE POUR CONDENSATEUR AU FILM
(JA) フィルムコンデンサ用高誘電性フィルム形成組成物
Abstract:
(EN) Provided is a high-dielectric film for film capacitors that is capable of preventing lowered electrical insulation, regardless of the fact that high-dielectric inorganic particles are compounded at a high filling rate. The high-dielectric film for film capacitors is formed by molding a composition for forming the film for film capacitors which contains a thermoplastic resin (A) and surface-treated high-dielectric inorganic particles (B) which are obtained by treating the surfaces of high-dielectric inorganic particles (b1) having a specific dielectric constant (at 20°C, 1 kHz) of 100 or higher with a low-dielectric compound (b2) having a specific dielectric constant (at 20°C, 1 kHz) of 10 or less.
(FR) L'invention concerne un film à constante diélectrique élevée pour condensateurs au film capable d'empêcher un abaissement de l'isolement électrique indépendamment du fait que les particules inorganiques à constante diélectrique élevée sont composées à un taux de remplissage élevé. Le film à constante diélectrique élevée pour condensateurs au film est formé par moulage d'une composition pour film destinée aux condensateurs au film contenant une résine thermoplastique (A) et des particules inorganiques à constante diélectrique élevée et surface traitée (B) obtenues en traitant les surfaces de particules inorganiques à constante diélectrique élevée (b1) ayant une constante diélectrique spécifique égale ou supérieure à 100 (à 20 °C, 1 kHz) avec un composé à faible constante diélectrique (b2) ayant une constante diélectrique spécifique égale ou inférieure à 10 (à 20 °C, 1 kHz).
(JA)  高誘電性無機粒子が高充填率で配合されているにもかかわらず、電気絶縁性の低下を抑制できるフィルムコンデンサ用高誘電性フィルムであって、熱可塑性樹脂(A)と、比誘電率(20℃、1kHz)が100以上の高誘電性無機粒子(b1)の表面を比誘電率(20℃、1kHz)が10以下の低誘電性化合物(b2)で表面処理して得られる表面処理高誘電性無機粒子(B)とを含むフィルムコンデンサ用フィルム形成組成物を成形して得られるフィルムコンデンサ用高誘電性フィルムを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2378529US20110249374CN102265362KR1020110096596