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1. (WO2010073981) CURABLE COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/073981 International Application No.: PCT/JP2009/071114
Publication Date: 01.07.2010 International Filing Date: 18.12.2009
IPC:
C08L 75/04 (2006.01) ,C08K 5/103 (2006.01) ,C08K 5/1535 (2006.01) ,C08L 63/00 (2006.01) ,H05K 3/28 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
75
Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
04
Polyurethanes
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
10
Esters; Ether-esters
101
of monocarboxylic acids
103
with polyalcohols
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
15
Heterocyclic compounds having oxygen in the ring
151
having one oxygen atom in the ring
1535
Five-membered rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
昭和電工株式会社 SHOWA DENKO K.K. [JP/JP]; 東京都港区芝大門一丁目13番9号 13-9, Shibadaimon 1-chome, Minato-ku, Tokyo 1058518, JP (AllExceptUS)
大賀 一彦 OOGA, Kazuhiko [JP/JP]; JP (UsOnly)
木村 和弥 KIMURA, Kazuya [JP/JP]; JP (UsOnly)
海野 篤 UMINO, Atsushi [JP/JP]; JP (UsOnly)
東 律子 AZUMA, Ritsuko [JP/JP]; JP (UsOnly)
Inventors:
大賀 一彦 OOGA, Kazuhiko; JP
木村 和弥 KIMURA, Kazuya; JP
海野 篤 UMINO, Atsushi; JP
東 律子 AZUMA, Ritsuko; JP
Agent:
特許業務法人SSINPAT SSINPAT PATENT FIRM; 東京都品川区西五反田七丁目13番6号 五反田山崎ビル6階 Gotanda Yamazaki Bldg. 6F, 13-6, Nishigotanda 7-chome, Shinagawa-ku, Tokyo 1410031, JP
Priority Data:
2008-33343026.12.2008JP
Title (EN) CURABLE COMPOSITION
(FR) COMPOSITION DURCISSABLE
(JA) 硬化性組成物
Abstract:
(EN) Provided is a curable composition that forms a cured product having low-warping properties and excellent long-term electrical insulation reliability, and that displays little bleeding during screen printing. The curable composition comprises the following components (a) through (e): component (a) polyurethane having carbonate bonds and functional groups that participate in the curing reaction; component (b) γ-butyrolactone; component (c) diethylene glycol diethyl ether; component (d) inorganic microparticles and/or organic microparticles; component (e) a compound having two or more epoxy groups per molecule. 
(FR) L'invention concerne une composition durcissable formant une produit durci présentant des propriétés de faible gondolage et une excellente fiabilité d'isolation électrique à long terme, et présentant une faible bavure pendant la sérigraphie. La composition selon l'invention contient les composants (a) à (e) suivants : un composant (a) de polyuréthane contenant des liaisons carbonate et des groupes fonctionnels participant à la réaction de durcissement ; un composant (b) de γ-butyrolactone ; un composant (c) d'éther diéthylique de diéthylène glycol ; un composant (d) de microparticules inorganiques et/ou de microparticules organiques ; un composant (e) d'un composé contenant au moins deux groupes époxy par molécule. 
(JA)  本発明は、低反り性、長期電気絶縁信頼性に優れた硬化物を与え、かつスクリーン印刷時のにじみが少ない硬化性組成物を提供することを目的としている。  本発明は、以下の成分(a)~(e)を含む硬化性組成物:成分(a)硬化反応する官能基及びカーボネート結合を有するポリウレタン、成分(b)γ-ブチロラクトン、成分(c)ジエチレングリコールジエチルエーテル、成分(d)無機微粒子及び/又は有機微粒子、成分(e)1分子中に2個以上のエポキシ基を有する化合物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2383310JPWO2010073981US20110253426CN102264838KR1020110104536