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1. (WO2010073952) COPPER FOIL WITH RESIN
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/073952 International Application No.: PCT/JP2009/071005
Publication Date: 01.07.2010 International Filing Date: 10.12.2009
IPC:
B32B 15/088 (2006.01) ,H05K 1/09 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
三菱瓦斯化学株式会社 MITSUBISHI GAS CHEMICAL COMPANY, INC. [JP/JP]; 東京都千代田区丸の内2-5-2 5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008324, JP (AllExceptUS)
株式会社ピーアイ技術研究所 PI R&D CO., LTD. [JP/JP]; 神奈川県横浜市金沢区鳥浜町12-5 12-5, Torihama-cho, Kanazawa-ku, Yokohama-shi, Kanagawa 2360002, JP (AllExceptUS)
野崎 充 NOZAKI, Mitsuru [JP/JP]; JP (UsOnly)
大森 貴文 OOMORI, Takabumi [JP/JP]; JP (UsOnly)
野本 昭宏 NOMOTO, Akihiro [JP/JP]; JP (UsOnly)
秋山 教克 AKIYAMA, Norikatsu [JP/JP]; JP (UsOnly)
永田 英史 NAGATA, Eiji [JP/JP]; JP (UsOnly)
矢野 真司 YANO, Masashi [JP/JP]; JP (UsOnly)
Inventors:
野崎 充 NOZAKI, Mitsuru; JP
大森 貴文 OOMORI, Takabumi; JP
野本 昭宏 NOMOTO, Akihiro; JP
秋山 教克 AKIYAMA, Norikatsu; JP
永田 英史 NAGATA, Eiji; JP
矢野 真司 YANO, Masashi; JP
Agent:
杉村 憲司 SUGIMURA, Kenji; JP
Priority Data:
2008-33440826.12.2008JP
Title (EN) COPPER FOIL WITH RESIN
(FR) FEUILLE DE CUIVRE COMPRENANT UNE RÉSINE
(JA) 樹脂複合銅箔
Abstract:
(EN) Disclosed is a copper foil with a resin, which permits the application of a copper foil having an extremely low-roughness matte surface, without impairing the adhesiveness to the resin composition of a copper-clad laminate.  Specifically disclosed is a copper foil with a resin, which is provided with both a copper foil and a polyimide resin layer, said polyimide resin layer containing both a specific block copolyimide resin and an inorganic filler.
(FR) L'invention porte sur une feuille de cuivre comprenant une résine, qui permet l'application d'une feuille de cuivre ayant une surface Lambertienne de rugosité extrêmement faible, sans diminution de l'adhésivité d'un stratifié cuivré à la composition de résine. De façon spécifique, l'invention porte sur une feuille de cuivre comprenant une résine, qui est dotée à la fois d'une feuille de cuivre et d'une couche de résine de polyimide, ladite couche de résine de polyimide contenant à la fois une résine de copolyimide séquencé spécifique et une charge inorganique.
(JA)  本発明は、銅張積層板の樹脂組成物との接着力を損なわずに、銅箔(マット)面の凹凸の極めて小さい銅箔の適用が可能な樹脂複合銅箔に関し、より詳しくは、銅箔とポリイミド樹脂層とを具え、該ポリイミド樹脂層が特定のブロック共重合ポリイミド樹脂と無機充填剤とを含有する、樹脂複合銅箔に関するものである。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2371536JPWO2010073952US20110281126CN102264539KR1020110100300KR1020170042670
MYPI 2011003455