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1. (WO2010073460) ELECTRICALLY CONNECTING DEVICE FOR SEMICONDUCTOR DEVICE AND CONTACT USED IN THE ELECTRICALLY CONNECTING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/073460 International Application No.: PCT/JP2009/005785
Publication Date: 01.07.2010 International Filing Date: 30.10.2009
IPC:
H01R 13/24 (2006.01) ,G01R 1/067 (2006.01) ,G01R 1/073 (2006.01) ,G01R 31/26 (2006.01) ,H01R 33/76 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
22
Contacts for co-operating by abutting
24
resilient; resiliently mounted
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26
Testing of individual semiconductor devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
33
Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
74
Devices having four or more poles
76
Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Applicants:
山一電機株式会社 YAMAICHI ELECTRONICS CO., LTD. [JP/JP]; 東京都大田区中馬込3-28-7 28-7, Nakamagome 3-chome, Ohta-ku, Tokyo 1438515, JP (AllExceptUS)
鈴木勝己 SUZUKI, Katsumi [JP/JP]; JP (UsOnly)
鈴木威之 SUZUKI, Takeyuki [JP/JP]; JP (UsOnly)
Inventors:
鈴木勝己 SUZUKI, Katsumi; JP
鈴木威之 SUZUKI, Takeyuki; JP
Agent:
谷義一 TANI, Yoshikazu; 東京都港区赤坂2丁目6-20 6-20, Akasaka 2-chome, Minato-ku, Tokyo 1070052, JP
Priority Data:
2008-33394826.12.2008JP
Title (EN) ELECTRICALLY CONNECTING DEVICE FOR SEMICONDUCTOR DEVICE AND CONTACT USED IN THE ELECTRICALLY CONNECTING DEVICE
(FR) DISPOSITIF DE CONNEXION ÉLECTRIQUE POUR DISPOSITIF À SEMI-CONDUCTEURS ET CONTACT UTILISÉ DANS LE DISPOSITIF DE CONNEXION ÉLECTRIQUE
(JA) 半導体装置用電気接続装置及びそれに使用されるコンタクト
Abstract:
(EN) Provided are an electrically connecting device and a contact, which improve positional accuracy of a contact point of a plunger brought into contact with a semiconductor device and achieve stable contact with the semiconductor device.  The contact is composed of the plunger and a coil spring unit which holds the plunger thereon.  The plunger includes an upper contact piece having a plurality of contact points on an upper end section, a wide width section, and a lower contact piece having two contact pieces each having a contact point on a lower end section.  The coil spring unit includes a funnel-shaped closely winding section, which includes a spring section, a guiding section and a finely winding section having the contact point on the lower end section.  The contact points arranged on the upper contact piece are arranged to planarly spread at intervals, and the contact points arranged on the two contact pieces of the lower contact piece are formed to elastically deform to each other.
(FR) L'invention porte sur un dispositif de connexion électrique et sur un contact qui améliorent la précision de positionnement d'un point de contact d'un plongeur, amené en contact avec un dispositif à semi-conducteurs, et qui établissent un contact stable avec le dispositif à semi-conducteurs. Le contact est composé du plongeur et d'une unité de ressort hélicoïdal qui maintient le plongeur sur elle. Le plongeur comprend une pièce de contact supérieure présentant une pluralité de points de contact sur une section d'extrémité supérieure, une section à grande largeur et une pièce de contact inférieure possédant deux pièces de contact ayant chacune un point de contact sur une section d'extrémité inférieure. L'unité de ressort hélicoïdal comprend une section d'enroulement serré en forme d'entonnoir qui comprend une section de ressort, une section de guidage et une section d'enroulement fin ayant le point de contact sur la section d'extrémité inférieure. Les points de contact agencés sur la pièce de contact supérieure sont agencés pour s'étaler de façon plane à intervalles, et les points de contact agencés sur les deux pièces de contact de la pièce de contact inférieure sont formés pour se déformer élastiquement l'un par rapport à l'autre.
(JA) 半導体装置と接触するプランジャの接点の位置精度を高めるとともに、半導体装置との安定した接触を可能とする電気接続装置及びコンタクトを提供する。プランジャと該プランジャをその上に保持するコイルバネユニットからなるコンタクトであって、プランジャは、上端部に複数の接点を有する上方接触片、幅広部、及びそれぞれが下端部に接点を有する2つの接触片を有する下方接触片を含んでおり、コイルバネユニットは、バネ部及び誘い込み部と下端部に接点を有する細巻き部とを含む漏斗状の密着巻き部分を含んでおり、上方接触片に設けられる複数の接点は、平面的な広がりを持つように間隔をおいて配置され、下方接触片の2つの接触片に設けられる接点は、互いに対して弾性変形可能に形成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US7677901CN102224641