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1. (WO2010073398) METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION ELEMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/073398 International Application No.: PCT/JP2008/073826
Publication Date: 01.07.2010 International Filing Date: 26.12.2008
IPC:
H01L 35/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34
Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Applicants:
富士通株式会社 FUJITSU LIMITED [JP/JP]; 〒2118588 神奈川県川崎市中原区上小田中4丁目1番1号 Kanagawa 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-shi, Kanagawa 2118588, JP (AllExceptUS)
栗原 和明 KURIHARA, Kazuaki [JP/JP]; JP (UsOnly)
肥田 勝春 HIDA, Masaharu [JP/JP]; JP (UsOnly)
山中 一典 YAMANAKA, Kazunori [JP/JP]; JP (UsOnly)
Inventors:
栗原 和明 KURIHARA, Kazuaki; JP
肥田 勝春 HIDA, Masaharu; JP
山中 一典 YAMANAKA, Kazunori; JP
Agent:
岡本 啓三 OKAMOTO, Keizo; 〒1030013 東京都中央区日本橋人形町3丁目11番7号 山西ビル4階 岡本国際特許事務所 Tokyo OKAMOTO PATENT OFFICE Yamanishi Bldg, 4F 11-7, Nihonbashi Ningyo-cho 3-chome Chuo-ku, Tokyo 1030013, JP
Priority Data:
Title (EN) METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION ELEMENT
(FR) PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE CONVERSION THERMOÉLECTRIQUE ET ÉLÉMENT DE CONVERSION THERMOÉLECTRIQUE
(JA) 熱電変換素子の製造方法及び熱電変換素子
Abstract:
(EN) Disclosed is a method for manufacturing a thermoelectric conversion element that can realize a further reduction in size and an increased integration density. Also disclosed is a thermoelectric conversion element. A p-type semiconductor sheet (11) and an n-type semiconductor sheet (13), which have been formed by kneading a semiconductor material powder, a binder resin, a plasticizer, and a surfactant together, are provided. Separating sheets (12, 14) formed by kneading a resin such as PMMA and a plasticizer together are also provided. Through-holes (12a, 14a) are formed in the separating sheets (12, 14). An electroconductive material is filled into the through-holes (12a, 14a). Thereafter, the p-type semiconductor sheet (11), the separating sheet (12), the n-type semiconductor sheet (13), and the separating sheet (14) are stacked on top of one another. The assembly is cut into a predetermined size followed by firing.
(FR) L'invention concerne un procédé de fabrication d'un élément de conversion thermoélectrique qui permet d'obtenir une réduction supplémentaire de taille et une augmentation de la densité d'intégration. L'invention concerne également un élément de conversion thermoélectrique. Une feuille semi-conductrice de type p (11) et une feuille semi-conductrice de type n (13), qui ont été formées en malaxant ensemble une poudre de matériau semi-conducteur, un liant résineux, un plastifiant et un agent de surface, sont fournies. Des feuilles de séparation (12, 14) formées en malaxant ensemble une résine telle que du PMMA et un plastifiant sont également fournies. Des trous traversants (12a, 14a) sont formés dans les feuilles de séparation (12, 14). Les trous traversants (12a, 14a) sont remplis d'un matériau électroconducteur. Ensuite, la feuille semi-conductrice de type p (11), la feuille de séparation (12), la feuille semi-conductrice de type n (13) et la feuille de séparation (14) sont empilées les unes au-dessus des autres. L'ensemble est découpé en une taille prédéterminée puis cuit.
(JA) 【課題】より一層の小型化及び高集積化が可能な熱電変換素子の製造方法及び熱電変換素子を提供する。 【解決手段】半導体材料粉末と、バインダ樹脂と、可塑剤と界面活性剤とを混練して形成されたp型半導体シート11及びn型半導体シート13を用意する。また、PMMA等の樹脂と可塑剤とを混練して形成された分離シート12,14を用意する。分離シート12,14には貫通孔12a,14aを形成し、貫通孔12a,14a内に導電材料を充填する。その後、p型半導体シート11、分離シート12、n型半導体シート13及び分離シート14を積層し、所定の大きさに切断した後、焼成処理する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2010073398