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1. (WO2010073388) LASER ABLATION-IN-LIQUID SYSTEM AND METHOD OF SUBDIVIDING SOLID MATERIAL
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/073388 International Application No.: PCT/JP2008/073800
Publication Date: 01.07.2010 International Filing Date: 26.12.2008
IPC:
B02C 19/18 (2006.01) ,A61K 9/00 (2006.01) ,B23K 26/06 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
02
CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
C
CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
19
Other disintegrating devices or methods
18
Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
K
PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES
9
Medicinal preparations characterised by special physical form
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
Applicants:
株式会社荏原製作所 EBARA CORPORATION [JP/JP]; 〒1448510 東京都大田区羽田旭町11-1 Tokyo 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 1448510, JP (AllExceptUS)
加藤 弘之 KATO, Hiroyuki [JP/JP]; JP (UsOnly)
松村 航 MATSUMURA, Wataru [JP/JP]; JP (UsOnly)
石黒 明夫 ISHIGURO, Akio [JP/JP]; JP (UsOnly)
入内嶋 義治 IRIUCHIJIMA, Yoshiharu [JP/JP]; JP (UsOnly)
梅田 勲 UMEDA, Isao [JP/JP]; JP (UsOnly)
平田 和也 HIRATA, Kazuya [JP/JP]; JP (UsOnly)
Inventors:
加藤 弘之 KATO, Hiroyuki; JP
松村 航 MATSUMURA, Wataru; JP
石黒 明夫 ISHIGURO, Akio; JP
入内嶋 義治 IRIUCHIJIMA, Yoshiharu; JP
梅田 勲 UMEDA, Isao; JP
平田 和也 HIRATA, Kazuya; JP
Agent:
志賀 正武 SHIGA, Masatake; 〒1006620 東京都千代田区丸の内一丁目9番2号 Tokyo 1-9-2, Marunouchi, Chiyoda-ku, Tokyo 1006620, JP
Priority Data:
Title (EN) LASER ABLATION-IN-LIQUID SYSTEM AND METHOD OF SUBDIVIDING SOLID MATERIAL
(FR) SYSTÈME D'ABLATION LASER EN PHASE LIQUIDE ET PROCÉDÉ DE FRAGMENTATION D'UNE MATIÈRE SOLIDE
(JA) 液中レーザーアブレーションシステムおよび固形物微細化方法
Abstract:
(EN) A laser ablation-in-liquid system, which irradiates laser light to a dispersion liquid in which solid materials are dispersed so that the solid materials are subdivided in the liquid, is provided with a light source that oscillates the laser light, a device in which a flow passage through which the dispersion liquid circulates is arranged, a beam splitter that carries out n-division of the laser light oscillated from the light source, where n is an integer that is equal to or more than 2, and a prism that irradiates the laser light divided by the beam splitter to the dispersion liquid circulating through the flow passage.
(FR) L'invention porte sur un système d'ablation laser en phase liquide, qui irradie avec de la lumière laser une dispersion liquide dans laquelle des matières solides sont dispersées de façon à ce que les matières solides soient fragmentées dans le liquide, lequel système est doté d'une source de lumière qui fait osciller la lumière laser, d'un dispositif dans lequel se trouve une voie d'écoulement par laquelle circule la dispersion liquide, d'un séparateur de faisceau qui effectue la séparation en n parties de la lumière laser oscillée à partir de la source de lumière, n étant un entier qui est supérieur ou égal à 2, et d'un prisme qui irradie la dispersion liquide circulant dans la voie d'écoulement avec la lumière laser séparée par le séparateur de faisceau.
(JA)  レーザー光を固形物を液中に分散させた分散液に照射することにより、前記分散液中の固形物を微細化する液中レーザーアブレーションシステムであって:前記レーザー光を発振する光源と;前記分散液を流動する流路が設けられたデバイスと;nを2以上の整数としたとき、前記光源から発振したレーザー光をn分割するビームスプリッターと;前記ビームスプリッターにより分割されたレーザー光を、前記流路中を流動する前記分散液に対して照射するプリズムと;を備える液中レーザーアブレーションシステム。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2010073388