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1. (WO2010072044) METHOD FOR PREPARING A MICRO-ELECTRO-MECHANICAL SYSTEMS MECHANICAL RELAY BASED ON METALLIC TITANIUM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/072044 International Application No.: PCT/CN2009/001163
Publication Date: 01.07.2010 International Filing Date: 20.10.2009
IPC:
H01H 49/00 (2006.01) ,B81C 1/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
H
ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
49
Apparatus or processes specially adapted to the manufacture of relays or parts thereof
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
Applicants:
北京大学 PEKING UNIVERSITY [CN/CN]; 中国北京市 海淀区颐和园路5号 5 Yiheyuan Road Haidian District Beijing 100871, CN (AllExceptUS)
陈兢 CHEN, Jing [CN/CN]; CN (UsOnly)
舒琼 SHU, Qiong [CN/CN]; CN (UsOnly)
张轶铭 ZHANG, Yiming [CN/CN]; CN (UsOnly)
Inventors:
陈兢 CHEN, Jing; CN
舒琼 SHU, Qiong; CN
张轶铭 ZHANG, Yiming; CN
Agent:
北京君尚知识产权代理事务所(普通合伙) BEIJING JOYSHINE INTELLECTUAL PROPERTY OFFICE; 中国北京市海淀区北四环西路68号左岸工社1316-1317室 Room 1316-1317, Left Bank Community Building No.68 Beisihuanxilu Road, Haidian District Beijing 100080, CN
Priority Data:
200810240592.925.12.2008CN
Title (EN) METHOD FOR PREPARING A MICRO-ELECTRO-MECHANICAL SYSTEMS MECHANICAL RELAY BASED ON METALLIC TITANIUM
(FR) PROCÉDÉ DE PRÉPARATION D'UN RELAIS MÉCANIQUE À SYSTÈMES MICROÉLECTROMÉCANIQUES BASÉ SUR DU TITANE MÉTALLIQUE
(ZH) 一种基于金属钛的MEMS机械继电器的制备方法
Abstract:
(EN) A method for preparing a MEMS relay based on metallic titanium. The method involves patterning a titanium substrate through photo-etching, and forming a shallow groove through etching; selecting glass matched with metallic titanium in thermal expansion coefficient; forming a metal connecting line on a surface of the glass; carrying out anodic bonding between the titanium substrate and the glass substrate; thinning and patterning a back side of the titanium substrate via photo-etching; and carrying out deep etching to drill through the titanium substrate to form a MEMS relay.
(FR) L'invention porte sur un procédé de préparation d'un relais à systèmes microélectromécaniques (MEMS) basé sur du titane métallique. Le procédé comprend la formation des motifs d'un substrat en titane par photogravure, et la formation d'une rainure peu profonde par gravure; la sélection d'un verre adapté au titane métallique en termes de coefficient de dilation thermique; la formation d'une ligne de connexion métallique sur une surface du verre; la réalisation d'un collage anodique entre le substrat en titane et le substrat en verre; l'amincissement et la formation des motifs d'un côté arrière du substrat en titane par photogravure; et la réalisation d'une gravure profonde pour percer à travers le substrat en titane afin de former un relais MEMS.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)